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    Mfr.Part #
    XCZU19EG-1FFVB1517E
    Manufacturer
    AMD Xilinx
    Package / Case
    1517-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1517FCBGA
    Stock
    18,675
    In Stock ：
    18,675

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Peripherals :
    DMA, WDT
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    RoHS Status :
    ROHS3 Compliant
    Speed :
    500MHz, 600MHz, 1.2GHz
    Published :
    2016
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Factory Lead Time :
    11 Weeks
    HTS Code :
    8542.31.00.01
    Packaging :
    Tray
    RAM Size :
    256KB
    Package / Case :
    1517-BBGA, FCBGA
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Operating Temperature :
    0°C~100°C TJ
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Number of I/O :
    644
    Architecture :
    MCU, FPGA
    Introducing System On Chip (SoC) AMD Xilinx XCZU19EG-1FFVB1517E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1517-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, XCZU19EG-1FFVB1517E pinout, XCZU19EG-1FFVB1517E datasheet PDF, XCZU19EG-1FFVB1517E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU19EG-1FFVB1517E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU19EG-1FFVB1517E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 644 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processors in this SoC.This system on a chip is packaged as 1517-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC EG series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 644 I/Os.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU19EG-1FFVB1517E System On Chip (SoC) applications.


    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
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