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XCZU17EG-3FFVE1924E

XCZU17EG-3FFVE1924E

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Mfr.Part #
XCZU17EG-3FFVE1924E
Manufacturer
AMD Xilinx
Package / Case
1924-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1924FCBGA
Stock
7,532
In Stock ：
7,532

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Number of I/O :
668
Architecture :
MCU, FPGA
Packaging :
Tray
Operating Temperature :
0°C~100°C TJ
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Primary Attributes :
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Package / Case :
1924-BBGA, FCBGA
RAM Size :
256KB
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
HTS Code :
8542.31.00.01
Series :
Zynq® UltraScale+™ MPSoC EG
Factory Lead Time :
11 Weeks
Peripherals :
DMA, WDT
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RoHS Status :
ROHS3 Compliant
Published :
2016
Speed :
600MHz, 667MHz, 1.5GHz
Introducing System On Chip (SoC) AMD Xilinx XCZU17EG-3FFVE1924E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：1924-BBGA, FCBGA, XCZU17EG-3FFVE1924E pinout, XCZU17EG-3FFVE1924E datasheet PDF, XCZU17EG-3FFVE1924E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU17EG-3FFVE1924E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 668 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is embedded in this SoC.It has been assigned a package 1924-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq® UltraScale+™ MPSoC EG is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Zynq®UltraScale+™ FPGA, 926K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 668 I/Os in total.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU17EG-3FFVE1924E System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
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