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XCZU17EG-2FFVE1924I

XCZU17EG-2FFVE1924I

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Mfr.Part #
XCZU17EG-2FFVE1924I
Manufacturer
AMD Xilinx
Package / Case
1924-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1924FCBGA
Stock
17,564
In Stock ：
17,564

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
RAM Size :
256KB
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.31.00.01
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed :
533MHz, 600MHz, 1.3GHz
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Published :
2016
Series :
Zynq® UltraScale+™ MPSoC EG
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals :
DMA, WDT
Architecture :
MCU, FPGA
Number of I/O :
668
Factory Lead Time :
11 Weeks
Package / Case :
1924-BBGA, FCBGA
Operating Temperature :
-40°C~100°C TJ
Primary Attributes :
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Introducing System On Chip (SoC) AMD Xilinx XCZU17EG-2FFVE1924I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1924-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XCZU17EG-2FFVE1924I pinout, XCZU17EG-2FFVE1924I datasheet PDF, XCZU17EG-2FFVE1924I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU17EG-2FFVE1924I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 668 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


On this SoC, there is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor.Assigned with the package 1924-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC EG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 926K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 668 I/Os.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU17EG-2FFVE1924I System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
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