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  6. XCZU17EG-2FFVC1760I
XCZU17EG-2FFVC1760I

XCZU17EG-2FFVC1760I

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Mfr.Part #
XCZU17EG-2FFVC1760I
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1760FCBGA
Stock
7,496
In Stock ：
7,496

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Packaging :
Tray
Published :
2016
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Peripherals :
DMA, WDT
HTS Code :
8542.31.00.01
Speed :
533MHz, 600MHz, 1.3GHz
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Architecture :
MCU, FPGA
RoHS Status :
ROHS3 Compliant
Series :
Zynq® UltraScale+™ MPSoC EG
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Number of I/O :
512
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Primary Attributes :
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RAM Size :
256KB
Package / Case :
1760-BBGA, FCBGA
Factory Lead Time :
11 Weeks
Operating Temperature :
-40°C~100°C TJ
Introducing System On Chip (SoC) AMD Xilinx XCZU17EG-2FFVC1760I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1760-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XCZU17EG-2FFVC1760I pinout, XCZU17EG-2FFVC1760I datasheet PDF, XCZU17EG-2FFVC1760I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU17EG-2FFVC1760I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 512 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC has been developed.There is a 1760-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+™ MPSoC EG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 926K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 512 inputs and outputs.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU17EG-2FFVC1760I System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control
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