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    Mfr.Part #
    XCZU17EG-1FFVB1517E
    Manufacturer
    AMD Xilinx
    Package / Case
    1517-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1517FCBGA
    Stock
    22,748
    In Stock ：
    22,748

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Factory Lead Time :
    11 Weeks
    HTS Code :
    8542.31.00.01
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Peripherals :
    DMA, WDT
    Published :
    2016
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Package / Case :
    1517-BBGA, FCBGA
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Speed :
    500MHz, 600MHz, 1.2GHz
    Packaging :
    Tray
    RAM Size :
    256KB
    Architecture :
    MCU, FPGA
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Number of I/O :
    644
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    RoHS Status :
    ROHS3 Compliant
    Operating Temperature :
    0°C~100°C TJ
    Introducing System On Chip (SoC) AMD Xilinx XCZU17EG-1FFVB1517E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1517-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, XCZU17EG-1FFVB1517E pinout, XCZU17EG-1FFVB1517E datasheet PDF, XCZU17EG-1FFVB1517E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU17EG-1FFVB1517E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU17EG-1FFVB1517E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 644 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC is built.Package 1517-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC EG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 926K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.644 I/Os are included in this SoC part.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU17EG-1FFVB1517E System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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