XCZU15EG-L2FFVC900E

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Mfr.Part #
XCZU15EG-L2FFVC900E
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 900FCBGA
Stock
35,518
In Stock :
35,518

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Terminal Position :
BOTTOM
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Form :
Ball
RoHS Status :
ROHS3 Compliant
Supply Voltage-Min (Vsup) :
0.698V
JESD-30 Code :
R-PBGA-B900
Series :
Zynq® UltraScale+™ MPSoC EG
Speed :
533MHz, 600MHz, 1.3GHz
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size :
256KB
Operating Temperature :
0°C~100°C TJ
Published :
2016
Factory Lead Time :
11 Weeks
Packaging :
Tray
HTS Code :
8542.31.00.01
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture :
MCU, FPGA
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Package / Case :
900-BBGA, FCBGA
Supply Voltage-Max (Vsup) :
0.742V
Supply Voltage :
0.72V
Primary Attributes :
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Peripherals :
DMA, WDT
Number of Terminations :
900
Number of I/O :
204
Introducing System On Chip (SoC) AMD Xilinx XCZU15EG-L2FFVC900E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:900-BBGA, FCBGA, Number of Terminations:900, XCZU15EG-L2FFVC900E pinout, XCZU15EG-L2FFVC900E datasheet PDF, XCZU15EG-L2FFVC900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU15EG-L2FFVC900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU15EG-L2FFVC900E


900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O 0.72V

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 900-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 747K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 204.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.698V.Having 900 terminations in total makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.The SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY, which are additional features.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU15EG-L2FFVC900E System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
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