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  6. XCZU15EG-L2FFVB1156E
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    Mfr.Part #
    XCZU15EG-L2FFVB1156E
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    27,838
    In Stock ：
    27,838

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Supply Voltage :
    0.72V
    Factory Lead Time :
    11 Weeks
    Additional Feature :
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    Supply Voltage-Max (Vsup) :
    0.742V
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Architecture :
    MCU, FPGA
    HTS Code :
    8542.31.00.01
    RAM Size :
    256KB
    Published :
    2016
    Terminal Form :
    Ball
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed :
    533MHz, 600MHz, 1.3GHz
    Supply Voltage-Min (Vsup) :
    0.698V
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Packaging :
    Tray
    Operating Temperature :
    0°C~100°C TJ
    Peripherals :
    DMA, WDT
    Package / Case :
    1156-BBGA, FCBGA
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    JESD-30 Code :
    R-PBGA-B1156
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Number of I/O :
    328
    Terminal Position :
    BOTTOM
    RoHS Status :
    ROHS3 Compliant
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Surface Mount :
    yes
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
    Introducing System On Chip (SoC) AMD Xilinx XCZU15EG-L2FFVB1156E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：1156-BBGA, FCBGA, XCZU15EG-L2FFVB1156E pinout, XCZU15EG-L2FFVB1156E datasheet PDF, XCZU15EG-L2FFVB1156E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU15EG-L2FFVB1156E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU15EG-L2FFVB1156E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 328 I/O 0.72V

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 1156-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 747K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 328.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.698V.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.The SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY, which are additional features.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


    There are a lot of Xilinx Inc.


    XCZU15EG-L2FFVB1156E System On Chip (SoC) applications.


    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
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