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  6. XCZU15EG-L1FFVB1156I
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    Mfr.Part #
    XCZU15EG-L1FFVB1156I
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    1,803
    In Stock ：
    1,803

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Factory Lead Time :
    11 Weeks
    JESD-30 Code :
    R-PBGA-B1156
    RAM Size :
    256KB
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Additional Feature :
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    Speed :
    500MHz, 600MHz, 1.2GHz
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Terminal Position :
    BOTTOM
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
    Supply Voltage :
    0.72V
    Supply Voltage-Max (Vsup) :
    0.742V
    Number of I/O :
    328
    Published :
    2016
    Package / Case :
    1156-BBGA, FCBGA
    RoHS Status :
    ROHS3 Compliant
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Peripherals :
    DMA, WDT
    Supply Voltage-Min (Vsup) :
    0.698V
    Operating Temperature :
    -40°C~100°C TJ
    HTS Code :
    8542.31.00.01
    Packaging :
    Tray
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Architecture :
    MCU, FPGA
    Surface Mount :
    yes
    Terminal Form :
    Ball
    Introducing System On Chip (SoC) AMD Xilinx XCZU15EG-L1FFVB1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XCZU15EG-L1FFVB1156I pinout, XCZU15EG-L1FFVB1156I datasheet PDF, XCZU15EG-L1FFVB1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU15EG-L1FFVB1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU15EG-L1FFVB1156I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 328 I/O 0.72V

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC is built.Package 1156-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC EG.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 747K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.328 I/Os are included in this SoC part.A 0.72V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.At least 0.698V can be supplied as a power source.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


    There are a lot of Xilinx Inc.


    XCZU15EG-L1FFVB1156I System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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