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XCZU11EG-3FFVC1760E

XCZU11EG-3FFVC1760E

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Mfr.Part #
XCZU11EG-3FFVC1760E
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1760FCBGA
Stock
9,353
In Stock ：
9,353

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Factory Lead Time :
11 Weeks
Packaging :
Tray
Primary Attributes :
Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
RAM Size :
256KB
Architecture :
MCU, FPGA
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed :
600MHz, 667MHz, 1.5GHz
Package / Case :
1760-BBGA, FCBGA
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Series :
Zynq® UltraScale+™ MPSoC EG
Peripherals :
DMA, WDT
Published :
2016
Number of I/O :
512
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.31.00.01
Operating Temperature :
0°C~100°C TJ
Introducing System On Chip (SoC) AMD Xilinx XCZU11EG-3FFVC1760E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1760-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, XCZU11EG-3FFVC1760E pinout, XCZU11EG-3FFVC1760E datasheet PDF, XCZU11EG-3FFVC1760E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU11EG-3FFVC1760E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 512 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


On this SoC, there is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor.Assigned with the package 1760-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC EG series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 653K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 512 I/Os.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU11EG-3FFVC1760E System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
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