XCVE1752-2LLEVSVA2197

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Mfr.Part #
XCVE1752-2LLEVSVA2197
Manufacturer
AMD Xilinx
Package / Case
Axial, Radial Bend
Datasheet
Download
Description
IC VERSAL AI-EDGE FPGA 2197BGA
Stock
9,290
In Stock :
9,290

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Resistance :
100 Ohms
Number of Terminations :
2
Product Status :
Active
Package / Case :
Axial, Radial Bend
Architecture :
MPU, FPGA
Power (Watts) :
0.25W, 1/4W
Size / Dimension :
0.091 Dia x 0.236 L (2.30mm x 6.00mm)
Failure Rate :
--
Package :
Tray
Number of I/O :
608
Height - Seated (Max) :
--
Peripherals :
DDR, DMA, PCIe
RAM Size :
-
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Packaging :
Tape and Reel (TR)
Temperature Coefficient :
0/ -400ppm/°C
Speed :
450MHz, 1.08GHz
Operating Temperature :
-55°C ~ 155°C
Tolerance :
±5%
Supplier Device Package :
Panasert
Primary Attributes :
Versal™ AI Core FPGA, 1M Logic Cells
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size :
-
Series :
CF
Composition :
Carbon Film
Features :
Flame Retardant Coating, Safety
Introducing System On Chip (SoC) AMD Xilinx XCVE1752-2LLEVSVA2197 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:2, Package / Case:Axial, Radial Bend, Operating Temperature:-55°C ~ 155°C, XCVE1752-2LLEVSVA2197 pinout, XCVE1752-2LLEVSVA2197 datasheet PDF, XCVE1752-2LLEVSVA2197 amp .Beyond System On Chip (SoC) AMD Xilinx XCVE1752-2LLEVSVA2197 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVE1752-2LLEVSVA2197


2 Terminations -55°C ~ 155°C System On Chip CF Series 608 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a Axial, Radial Bend package as per the manufacturer's specifications.A SoC chip with - RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MPU, FPGA technique.It is part of the CF series of system on a chips.It is recommended that this SoC meaning be operated at -55°C ~ 155°C on an average.As one of the most important things to note is that this SoC security combines Versal™ AI Core FPGA, 1M Logic Cells together.Tape & Reel (TR) package houses this SoC system on a chip.An integral part of this SoC consists of a total of 608 I/Os.The system on a chip uses 2 terminations in total.As for its flash size, it is -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of AMD


XCVE1752-2LLEVSVA2197 System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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