XCVE1752-2LLEVSVA2197
- Mfr.Part #
- XCVE1752-2LLEVSVA2197
- Manufacturer
- AMD Xilinx
- Package / Case
- Axial, Radial Bend
- Datasheet
- Download
- Description
- IC VERSAL AI-EDGE FPGA 2197BGA
- Stock
- 9,290
- In Stock :
- 9,290
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Resistance :
- 100 Ohms
- Number of Terminations :
- 2
- Product Status :
- Active
- Package / Case :
- Axial, Radial Bend
- Architecture :
- MPU, FPGA
- Power (Watts) :
- 0.25W, 1/4W
- Size / Dimension :
- 0.091 Dia x 0.236 L (2.30mm x 6.00mm)
- Failure Rate :
- --
- Package :
- Tray
- Number of I/O :
- 608
- Height - Seated (Max) :
- --
- Peripherals :
- DDR, DMA, PCIe
- RAM Size :
- -
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Packaging :
- Tape and Reel (TR)
- Temperature Coefficient :
- 0/ -400ppm/°C
- Speed :
- 450MHz, 1.08GHz
- Operating Temperature :
- -55°C ~ 155°C
- Tolerance :
- ±5%
- Supplier Device Package :
- Panasert
- Primary Attributes :
- Versal™ AI Core FPGA, 1M Logic Cells
- Core Processor :
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size :
- -
- Series :
- CF
- Composition :
- Carbon Film
- Features :
- Flame Retardant Coating, Safety
- Datasheets
- XCVE1752-2LLEVSVA2197

2 Terminations -55°C ~ 155°C System On Chip CF Series 608 I/O
This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a Axial, Radial Bend package as per the manufacturer's specifications.A SoC chip with - RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MPU, FPGA technique.It is part of the CF series of system on a chips.It is recommended that this SoC meaning be operated at -55°C ~ 155°C on an average.As one of the most important things to note is that this SoC security combines Versal™ AI Core FPGA, 1M Logic Cells together.Tape & Reel (TR) package houses this SoC system on a chip.An integral part of this SoC consists of a total of 608 I/Os.The system on a chip uses 2 terminations in total.As for its flash size, it is -.
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.
- RAM.
Built on MPU, FPGA.
- extended flash.
There are a lot of AMD
XCVE1752-2LLEVSVA2197 System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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