XCVE1752-1LSIVSVA2197

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Mfr.Part #
XCVE1752-1LSIVSVA2197
Manufacturer
AMD Xilinx
Package / Case
2197-BFBGA, FCBGA
Datasheet
Download
Description
IC VERSAL AI-EDGE FPGA 2197BGA
Stock
9,997
In Stock :
9,997

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Package / Case :
2197-BFBGA, FCBGA
Maximum Operating Temperature :
+ 110 C
Operating Supply Voltage :
700 mV
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Flash Size :
-
Resistor Type :
High Reliability, MIL-PRF-39017
Supplier Device Package :
2197-FCBGA (45x45)
Package :
Tray
Number of I/O :
608
RAM Size :
-
Operating Temperature :
-40°C ~ 100°C (TJ)
Peripherals :
DDR, DMA, PCIe
Subcategory :
SOC - Systems on a Chip
Manufacturer :
Xilinx
Resistance Tolerance :
1
Series :
Versal™ AI Core
Product Category :
SoC FPGA
Product Type :
System-On-Modules - SOM
Product Status :
Active
Power Rating :
250 mW
Architecture :
MPU, FPGA
Primary Attributes :
Versal™ AI Core FPGA, 1M Logic Cells
Brand :
Xilinx
Speed :
400MHz, 1GHz
Minimum Operating Temperature :
- 40 C
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Introducing System On Chip (SoC) AMD Xilinx XCVE1752-1LSIVSVA2197 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2197-BFBGA, FCBGA, Operating Temperature:-40°C ~ 100°C (TJ), XCVE1752-1LSIVSVA2197 pinout, XCVE1752-1LSIVSVA2197 datasheet PDF, XCVE1752-1LSIVSVA2197 amp .Beyond System On Chip (SoC) AMD Xilinx XCVE1752-1LSIVSVA2197 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVE1752-1LSIVSVA2197


-40°C ~ 100°C (TJ) System On Chip Versal™ AI Core Series 608 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, this SoC has been developed.There is a 2197-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With - RAM implemented, this SoC chip provides reliable operation.A MPU, FPGA technique is used for the SoC design's internal architecture.Versal™ AI Core is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C ~ 100°C (TJ) when it is operating normally.A significant feature of this SoC security is the combination of Versal™ AI Core FPGA, 1M Logic Cells.As a whole, this SoC part is comprised of 608 inputs and outputs.Furthermore, it has a remarkable system on a chip capability, much like other high-quality SOC - Systems on a Chip.This flash has a size of -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVE1752-1LSIVSVA2197 System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control
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