XCV600E-8FG680C

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Mfr.Part #
XCV600E-8FG680C
Manufacturer
AMD Xilinx
Package / Case
680-LBGA Exposed Pad
Datasheet
Download
Description
IC FPGA 512 I/O 680FTEBGA
Stock
38,060
In Stock :
38,060

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max :
0.4 ns
Published :
1999
Base Part Number :
XCV600E
Supply Voltage :
1.8V
RoHS Status :
Non-RoHS Compliant
Number of Outputs :
512
Terminal Finish :
Tin/Lead (Sn63Pb37)
Mounting Type :
Surface Mount
Pbfree Code :
No
Operating Supply Voltage :
1.8V
Width :
40mm
Number of Logic Elements/Cells :
15552
Speed Grade :
8
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Package / Case :
680-LBGA Exposed Pad
Number of Gates :
985882
Operating Temperature :
0°C~85°C TJ
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
30
Number of Terminations :
680
Series :
Virtex®-E
Peak Reflow Temperature (Cel) :
225
Terminal Form :
Ball
Total RAM Bits :
294912
JESD-609 Code :
e0
Number of Inputs :
512
Terminal Pitch :
1mm
Radiation Hardening :
No
Pin Count :
680
Voltage - Supply :
1.71V~1.89V
Clock Frequency :
416MHz
Number of LABs/CLBs :
3456
Lead Free :
Contains Lead
RAM Size :
36KB
Height Seated (Max) :
1.9mm
Mount :
Surface Mount
Length :
40mm
ECCN Code :
3A991.D
Number of I/O :
512
Datasheets
XCV600E-8FG680C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-8FG680C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV600E, Mounting Type:Surface Mount, Package / Case:680-LBGA Exposed Pad, Operating Temperature:0°C~85°C TJ, Number of Terminations:680, XCV600E-8FG680C pinout, XCV600E-8FG680C datasheet PDF, XCV600E-8FG680C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-8FG680C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.9mm mm FPGAs Virtex®-E Series 680-LBGA Exposed Pad 1mm mm 680

XCV600E-8FG680C Overview


In the package 680-LBGA Exposed Pad, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 512 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 15552 logic elements/cells. Supply voltage is 1.8V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-E series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 512 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 680. Fpga electronics is worth mentioning that this device provides 294912 bfpga electronics s of RAM. XCV600E is the base part number that can be used to identify related parts. The RAM si36kBe of this FPGA module reaches 36kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 3456 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 985882 gates. I am going to present you with a device that is equipped with 680 pins. Fpga semiconductor typically uses a crystal oscillating at 416MHz.

XCV600E-8FG680C Features


512 I/Os
Up to 294912 RAM bits


XCV600E-8FG680C Applications


There are a lot of Xilinx Inc.
XCV600E-8FG680C FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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