XCV600-5BG560C
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- Mfr.Part #
- XCV600-5BG560C
- Manufacturer
- AMD Xilinx
- Package / Case
- 560-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 404 I/O 560MBGA
- Stock
- 8,219
- In Stock ：
- 8,219
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Reach Compliance Code :
- not_compliant
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Pbfree Code :
- No
- JESD-30 Code :
- S-PBGA-B560
- Lead Free :
- Contains Lead
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 2.375V~2.625V
- Terminal Form :
- Ball
- Pin Count :
- 560
- Width :
- 42.5mm
- Number of Logic Elements/Cells :
- 15552
- Mounting Type :
- Surface Mount
- Series :
- Virtex®
- Number of LABs/CLBs :
- 3456
- Published :
- 2000
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage :
- 2.5V
- Number of Terminations :
- 560
- Package / Case :
- 560-LBGA Exposed Pad, Metal
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Inputs :
- 404
- Number of Outputs :
- 404
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 98304
- Mount :
- Surface Mount
- RAM Size :
- 12kB
- Terminal Pitch :
- 1.27mm
- JESD-609 Code :
- e0
- Operating Temperature :
- 0°C~85°C TJ
- Number of Gates :
- 661111
- Height Seated (Max) :
- 1.7mm
- Packaging :
- Tray
- Terminal Position :
- BOTTOM
- Base Part Number :
- XCV600
- Length :
- 42.5mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- HTS Code :
- 8542.39.00.01
- Power Supplies :
- 1.2/3.62.5V
- Clock Frequency :
- 294MHz
- ECCN Code :
- EAR99
- Number of I/O :
- 404
- Peak Reflow Temperature (Cel) :
- 225
- Datasheets
- XCV600-5BG560C
1.7mm mm FPGAs Virtex® Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560
XCV600-5BG560C Overview
The package that contains this software is called 560-LBGA Exposed Pad, Metal. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 404 I/Os for better data transfer. In order to construct a fundamental building block, 15552 logic elements/cells are required. In order for the device to operate, a supply voltage of 2.5V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 2.375V~2.625V battery. There are many types of FPGAs in the Virtex® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 404 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 560 terminations. As far as the RAM bits are concerned, this device offers you a total of 98304. If you are looking for related parts, you can use the base part number XCV600 as a starting point. For the program to work properly, the RAM si12kBe of this FPGA module must reach 12kB GB in order to ensure normal operation. 3456 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In order for fpga electronics to work, fpga electronics requires a 1.2/3.62.5V power supply. As a basic building block, fpga semiconductor consists of 661111 gates. A total of 560 pins are included in this device. Most of the time, it uses a crystal oscillating at 294MHz to generate the signal.
XCV600-5BG560C Features
404 I/Os
Up to 98304 RAM bits
XCV600-5BG560C Applications
There are a lot of Xilinx Inc.
XCV600-5BG560C FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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