XCV600-5FG676I
- Mfr.Part #
- XCV600-5FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 444 I/O 676FCBGA
- Stock
- 21,773
- In Stock :
- 21,773
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- EAR99
- Pin Count :
- 676
- Reach Compliance Code :
- not_compliant
- Number of Terminations :
- 676
- Packaging :
- Tray
- Number of Gates :
- 661111
- Power Supplies :
- 1.2/3.62.5V
- Number of Outputs :
- 444
- Published :
- 2010
- Lead Free :
- Contains Lead
- Peak Reflow Temperature (Cel) :
- 225
- Total RAM Bits :
- 98304
- Operating Temperature :
- -40°C~100°C TJ
- JESD-30 Code :
- S-PBGA-B676
- Base Part Number :
- XCV600
- Mounting Type :
- Surface Mount
- RAM Size :
- 12kB
- Terminal Form :
- Ball
- Width :
- 27mm
- Number of Inputs :
- 444
- Length :
- 27mm
- Voltage - Supply :
- 2.375V~2.625V
- Mount :
- Surface Mount
- RoHS Status :
- Non-RoHS Compliant
- Qualification Status :
- Not Qualified
- Number of I/O :
- 444
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 294MHz
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Height Seated (Max) :
- 2.6mm
- Terminal Pitch :
- 1mm
- Package / Case :
- 676-BBGA, FCBGA
- Pbfree Code :
- No
- Series :
- Virtex®
- JESD-609 Code :
- e0
- Number of LABs/CLBs :
- 3456
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage :
- 2.5V
- HTS Code :
- 8542.39.00.01
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Elements/Cells :
- 15552
- Datasheets
- XCV600-5FG676I

FPGAs AMD Xilinx XCV600-5FG676I Overview
Introducing the AMD Xilinx XCV600-5FG676I, a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding requirements of modern digital circuits. This FPGA combines versatility with high functionality, accommodating a broad range of applications from signal processing to complex logic operations. The XCV600-5FG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FCBGA) package, supporting 444 I/Os which makes it ideal for multi-functional integration in complex systems. This integration capability, combined with AMD Xilinx's robust technology, ensures that the FPGA not only meets but exceeds the stringent performance criteria required in today's fast-evolving technological landscape, making it a prime choice for B2B customers looking to buy in bulk.
XCV600-5FG676I Features
The XCV600-5FG676I FPGA from AMD Xilinx boasts several features that make it a standout option for advanced digital applications. Key features include a robust 676FCBGA package that optimizes thermal performance and minimizes electrical noise, extensive I/O capabilities with 444 ports for flexible connectivity, and superior processing power suitable for high-speed data processing and real-time applications. Additionally, the device's compatibility with multiple design environments streamlines development, thereby reducing time-to-market for tech-driven companies.
XCV600-5FG676I Applications
- Data Centers: Utilized for accelerating data processing tasks, this FPGA can handle complex algorithms used in high-speed server operations, improving overall efficiency and performance.
- Telecommunications: Supports the development of telecommunications equipment, facilitating enhanced signal processing capabilities necessary for 5G technology and other advanced communication systems.
- Automotive: Applied in advanced driver-assistance systems (ADAS), the XCV600-5FG676I helps in processing real-time sensory data, crucial for vehicle safety and automation.
- Consumer Electronics: Integrates into consumer electronics to enhance multimedia processing and connectivity, leading to smarter and more responsive devices.
- Aerospace: Employs in avionics for both commercial and military aerospace applications, where its capacity to process complex navigational data is invaluable.
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