XCV600-5FG676I

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Mfr.Part #
XCV600-5FG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 444 I/O 676FCBGA
Stock
21,773
In Stock :
21,773

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
ECCN Code :
EAR99
Pin Count :
676
Reach Compliance Code :
not_compliant
Number of Terminations :
676
Packaging :
Tray
Number of Gates :
661111
Power Supplies :
1.2/3.62.5V
Number of Outputs :
444
Published :
2010
Lead Free :
Contains Lead
Peak Reflow Temperature (Cel) :
225
Total RAM Bits :
98304
Operating Temperature :
-40°C~100°C TJ
JESD-30 Code :
S-PBGA-B676
Base Part Number :
XCV600
Mounting Type :
Surface Mount
RAM Size :
12kB
Terminal Form :
Ball
Width :
27mm
Number of Inputs :
444
Length :
27mm
Voltage - Supply :
2.375V~2.625V
Mount :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Qualification Status :
Not Qualified
Number of I/O :
444
Terminal Position :
BOTTOM
Clock Frequency :
294MHz
Combinatorial Delay of a CLB-Max :
0.7 ns
Terminal Finish :
Tin/Lead (Sn63Pb37)
Height Seated (Max) :
2.6mm
Terminal Pitch :
1mm
Package / Case :
676-BBGA, FCBGA
Pbfree Code :
No
Series :
Virtex®
JESD-609 Code :
e0
Number of LABs/CLBs :
3456
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
2.5V
HTS Code :
8542.39.00.01
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
15552
Datasheets
XCV600-5FG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600-5FG676I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Operating Temperature:-40°C~100°C TJ, Base Part Number:XCV600, Mounting Type:Surface Mount, Package / Case:676-BBGA, FCBGA, XCV600-5FG676I pinout, XCV600-5FG676I datasheet PDF, XCV600-5FG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600-5FG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV600-5FG676I


FPGAs AMD Xilinx XCV600-5FG676I Overview

Introducing the AMD Xilinx XCV600-5FG676I, a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding requirements of modern digital circuits. This FPGA combines versatility with high functionality, accommodating a broad range of applications from signal processing to complex logic operations. The XCV600-5FG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FCBGA) package, supporting 444 I/Os which makes it ideal for multi-functional integration in complex systems. This integration capability, combined with AMD Xilinx's robust technology, ensures that the FPGA not only meets but exceeds the stringent performance criteria required in today's fast-evolving technological landscape, making it a prime choice for B2B customers looking to buy in bulk.

XCV600-5FG676I Features

The XCV600-5FG676I FPGA from AMD Xilinx boasts several features that make it a standout option for advanced digital applications. Key features include a robust 676FCBGA package that optimizes thermal performance and minimizes electrical noise, extensive I/O capabilities with 444 ports for flexible connectivity, and superior processing power suitable for high-speed data processing and real-time applications. Additionally, the device's compatibility with multiple design environments streamlines development, thereby reducing time-to-market for tech-driven companies.

XCV600-5FG676I Applications

  • Data Centers: Utilized for accelerating data processing tasks, this FPGA can handle complex algorithms used in high-speed server operations, improving overall efficiency and performance.
  • Telecommunications: Supports the development of telecommunications equipment, facilitating enhanced signal processing capabilities necessary for 5G technology and other advanced communication systems.
  • Automotive: Applied in advanced driver-assistance systems (ADAS), the XCV600-5FG676I helps in processing real-time sensory data, crucial for vehicle safety and automation.
  • Consumer Electronics: Integrates into consumer electronics to enhance multimedia processing and connectivity, leading to smarter and more responsive devices.
  • Aerospace: Employs in avionics for both commercial and military aerospace applications, where its capacity to process complex navigational data is invaluable.
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