XCV600E-7FG900C

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Mfr.Part #
XCV600E-7FG900C
Manufacturer
AMD Xilinx
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 512 I/O 900FBGA
Stock
21,622
In Stock :
21,622

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
ECCN Code :
EAR99
Pbfree Code :
No
RoHS Status :
Non-RoHS Compliant
Number of Gates :
985882
Number of Terminations :
900
Pin Count :
900
Mounting Type :
Surface Mount
Base Part Number :
XCV600E
Operating Supply Voltage :
1.8V
Total RAM Bits :
294912
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
15552
Package / Case :
900-BBGA
Packaging :
Tray
Peak Reflow Temperature (Cel) :
225
Supply Voltage :
1.8V
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
400MHz
Number of I/O :
512
Published :
1999
Mount :
Surface Mount
Number of LABs/CLBs :
3456
Combinatorial Delay of a CLB-Max :
0.42 ns
Width :
31mm
Time@Peak Reflow Temperature-Max (s) :
30
Speed Grade :
7
Operating Temperature :
0°C~85°C TJ
Voltage - Supply :
1.71V~1.89V
Number of Pins :
900
HTS Code :
8542.39.00.01
Number of Equivalent Gates :
186624
Length :
31mm
Lead Free :
Contains Lead
Terminal Form :
Ball
Radiation Hardening :
No
JESD-609 Code :
e0
Terminal Pitch :
1mm
Height Seated (Max) :
2.6mm
Number of Outputs :
512
Series :
Virtex®-E
RAM Size :
36KB
Datasheets
XCV600E-7FG900C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-7FG900C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:900, Mounting Type:Surface Mount, Base Part Number:XCV600E, Package / Case:900-BBGA, Operating Temperature:0°C~85°C TJ, Number of Pins:900, XCV600E-7FG900C pinout, XCV600E-7FG900C datasheet PDF, XCV600E-7FG900C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-7FG900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV600E-7FG900C


FPGAs AMD Xilinx XCV600E-7FG900C Overview

The AMD Xilinx XCV600E-7FG900C FPGA is a high-performance, field-programmable gate array that offers a versatile solution for a variety of complex digital processing tasks. With its robust configuration of 512 I/Os and a compact 900FBGA package, this FPGA facilitates efficient design implementations and swift system integrations, making it a top choice for engineers and developers seeking flexibility and scalability in their hardware solutions. Its substantial logic capacity and the adaptability provided by AMD Xilinx technology make the XCV600E-7FG900C an excellent candidate for advanced digital applications, ensuring reliable operation and enhanced performance.

XCV600E-7FG900C Features

The XCV600E-7FG900C FPGA by AMD Xilinx is packed with features that enhance its utility and efficiency in sophisticated electronic systems. This includes a vast array of 512 input/output ports which are crucial for complex, multi-layered designs requiring numerous connections. Housed in a 900-pin fine-pitch ball grid array (FBGA), it offers superb thermal and electrical performance, which is essential for high-speed digital processing. Additionally, the scalability of FPGA technology allows for post-production modifications, which adds a layer of future-proofing for developing technologies.

XCV600E-7FG900C Applications

  • Telecommunications Infrastructure: Used in routers and switches to manage data traffic efficiently and to enhance network reliability.
  • Automotive Systems: Integral for driver assistance systems where real-time processing is crucial for vehicle safety and performance.
  • Consumer Electronics: Empowers high-definition video processing units in devices such as smart TVs and gaming consoles for optimal performance.
  • Industrial Automation: Forms the backbone of control systems and robotic operations, improving precision and productivity in manufacturing processes.
  • Aerospace and Defense: Utilized in satellite communications and avionic control systems, offering robustness and resistance to harsh environments.
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