XCV600E-7FG676I
- Mfr.Part #
- XCV600E-7FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 444 I/O 676FCBGA
- Stock
- 8,230
- In Stock :
- 8,230
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Voltage - Supply :
- 1.71V~1.89V
- Base Part Number :
- XCV600E
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Terminal Pitch :
- 1mm
- Supply Voltage :
- 1.8V
- RAM Size :
- 36KB
- HTS Code :
- 8542.39.00.01
- Package / Case :
- 676-BBGA, FCBGA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Total RAM Bits :
- 294912
- Number of Outputs :
- 444
- Number of LABs/CLBs :
- 3456
- Speed Grade :
- 7
- Radiation Hardening :
- No
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of I/O :
- 444
- Operating Supply Voltage :
- 1.8V
- Pin Count :
- 676
- Height Seated (Max) :
- 2.6mm
- Number of Logic Elements/Cells :
- 15552
- Number of Terminations :
- 676
- Operating Temperature :
- -40°C~100°C TJ
- RoHS Status :
- Non-RoHS Compliant
- Packaging :
- Tray
- Number of Equivalent Gates :
- 186624
- Number of Gates :
- 985882
- Series :
- Virtex®-E
- Clock Frequency :
- 400MHz
- Peak Reflow Temperature (Cel) :
- 225
- Combinatorial Delay of a CLB-Max :
- 0.42 ns
- Mounting Type :
- Surface Mount
- ECCN Code :
- 3A991.D
- JESD-609 Code :
- e0
- Lead Free :
- Contains Lead
- Pbfree Code :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Pins :
- 676
- Published :
- 1999
- Datasheets
- XCV600E-7FG676I

FPGAs AMD Xilinx XCV600E-7FG676I Overview
Introducing the XCV600E-7FG676I by AMD Xilinx, a high-performance Field Programmable Gate Array (FPGA) that offers unparalleled flexibility and capability in system design and integration. This advanced FPGA is designed to meet the rigorous demands of modern electronics, enabling developers and engineers to achieve robust system performance with customized logic configurations. The XCV600E-7FG676I is particularly suitable for applications requiring rapid prototyping and complex digital processing. As part of the FPGAs AMD Xilinx XCV600E-7FG676I category, this component provides a versatile platform for innovation across various high-tech industries.
XCV600E-7FG676I Features
The XCV600E-7FG676I FPGA features 444 I/O pins enclosed in a 676-pin flip-chip Ball Grid Array (FCBGA) package, ensuring extensive connectivity and high-speed signal integrity. This device supports a range of digital and mixed-signal applications, bolstered by its robust architecture that allows for scalable configurations and extensive programmability. Enhanced with security and reliability, the XCV600E-7FG676I is built to provide a stable development environment that can accommodate complex algorithms and multi-faceted system designs.
XCV600E-7FG676I Applications
- Telecommunications: The high I/O count and versatile programmability make the XCV600E-7FG676I ideal for network infrastructure, including routers, switches, and base stations, facilitating rapid data processing and improved signal integrity.
- Automotive: Utilized in advanced driver-assistance systems (ADAS), the FPGA can process multiple sensor inputs to enhance vehicle safety and performance capabilities.
- Industrial Automation: In manufacturing and automation systems, this FPGA enables precise control and real-time processing, supporting complex machinery operations and system monitoring.
- Data Centers: Critical for managing data throughput and security, the XCV600E-7FG676I excels in scalable digital solutions that optimize data storage and access in server farms and large-scale computing environments.
- Consumer Electronics: The FPGA is integral to enhancing multimedia applications, including video processing and home automation systems, by allowing flexible hardware configuration for optimized performance.
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