XCV600E-6FG900C
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- Mfr.Part #
- XCV600E-6FG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 512 I/O 900FBGA
- Stock
- 45,412
- In Stock ：
- 45,412
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Published :
- 1999
- Voltage - Supply :
- 1.71V~1.89V
- Number of Gates :
- 985882
- JESD-609 Code :
- e0
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- HTS Code :
- 8542.39.00.01
- Terminal Position :
- BOTTOM
- Pin Count :
- 900
- Radiation Hardening :
- No
- Number of Outputs :
- 512
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Terminations :
- 900
- Packaging :
- Tray
- RoHS Status :
- Non-RoHS Compliant
- Peak Reflow Temperature (Cel) :
- 225
- Width :
- 31mm
- Mounting Type :
- Surface Mount
- Number of LABs/CLBs :
- 3456
- RAM Size :
- 36KB
- Number of Pins :
- 900
- Number of Logic Elements/Cells :
- 15552
- Terminal Pitch :
- 1mm
- Mount :
- Surface Mount
- ECCN Code :
- EAR99
- Package / Case :
- 900-BBGA
- Clock Frequency :
- 357MHz
- Supply Voltage :
- 1.8V
- Length :
- 31mm
- Base Part Number :
- XCV600E
- Operating Supply Voltage :
- 1.8V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Speed Grade :
- 6
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of I/O :
- 512
- Operating Temperature :
- 0°C~85°C TJ
- Total RAM Bits :
- 294912
- Series :
- Virtex®-E
- Lead Free :
- Contains Lead
- Pbfree Code :
- No
- Terminal Form :
- Ball
- Datasheets
- XCV600E-6FG900C
FPGAs AMD Xilinx XCV600E-6FG900C Overview
The FPGAs AMD Xilinx XCV600E-6FG900C is a high-performance Field Programmable Gate Array (FPGA) designed to meet the demands of high-throughput, complex digital processing applications. This device offers a versatile solution that integrates 512 input/output (I/O) options with a compact 900-ball Fine-Pitch Ball Grid Array (FBGA) package, ensuring robust performance in a wide range of industrial environments. The XCV600E-6FG900C is optimized for scalable architectures, providing designers with a flexible and efficient path to integrate into existing and future project designs, making it ideal for a variety of challenging applications.
XCV600E-6FG900C Features
This AMD Xilinx FPGA is equipped with a multitude of features suited for high-end digital processing. It supports a wide range of configurations and programming options, providing ample flexibility for custom solutions. Its large number of I/O ports ensures ease of integration with a broad spectrum of peripheral devices, while the advanced 900FBGA packaging allows for efficient space utilization and superior thermal management, critical for maintaining reliability and performance under demanding conditions.
XCV600E-6FG900C Applications
- Telecommunications: The device can be integrated into network infrastructure equipment, facilitating improved signal processing capabilities and supporting advanced communications protocols.
- Automotive Systems: Suitable for deployment in driver assistance systems, the XCV600E-6FG900C provides the necessary computing power to handle complex sensor inputs and real-time decision making.
- Data Center: Utilized in data processing units within data centers, this FPGA accelerates data throughput and processing speeds, enhancing overall data center efficiency and reliability.
- Medical Equipment: In medical imaging systems, the XCV600E-6FG900C supports advanced image processing algorithms necessary for high-resolution imaging and diagnostics.
- Aerospace and Defense: The robustness of this FPGA makes it ideal for applications in aerospace and defense, where reliability and the ability to operate in extreme environmental conditions are paramount.
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