XCV600E-6FG676I

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Mfr.Part #
XCV600E-6FG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 444 I/O 676FCBGA
Stock
12,294
In Stock :
12,294

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Pin Count :
676
Packaging :
Tray
Lead Free :
Contains Lead
Mounting Type :
Surface Mount
Length :
27mm
Number of Logic Elements/Cells :
15552
Voltage - Supply :
1.71V~1.89V
Width :
27mm
JESD-609 Code :
e0
Combinatorial Delay of a CLB-Max :
0.47 ns
Time@Peak Reflow Temperature-Max (s) :
30
RoHS Status :
Non-RoHS Compliant
Total RAM Bits :
294912
Published :
2013
Terminal Position :
BOTTOM
Number of LABs/CLBs :
3456
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Radiation Hardening :
No
Peak Reflow Temperature (Cel) :
225
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Gates :
985882
Speed Grade :
6
Supply Voltage :
1.8V
ECCN Code :
3A991.D
Package / Case :
676-BBGA, FCBGA
Number of Pins :
676
HTS Code :
8542.39.00.01
Number of Outputs :
444
Mount :
Surface Mount
Operating Supply Voltage :
1.8V
Clock Frequency :
357MHz
Pbfree Code :
No
Operating Temperature :
-40°C~100°C TJ
RAM Size :
36KB
Number of I/O :
444
Number of Terminations :
676
Base Part Number :
XCV600E
Terminal Form :
Ball
Series :
Virtex®-E
Datasheets
XCV600E-6FG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-6FG676I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:676-BBGA, FCBGA, Number of Pins:676, Operating Temperature:-40°C~100°C TJ, Number of Terminations:676, Base Part Number:XCV600E, XCV600E-6FG676I pinout, XCV600E-6FG676I datasheet PDF, XCV600E-6FG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-6FG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV600E-6FG676I


FPGAs AMD Xilinx XCV600E-6FG676I Overview

Introducing the FPGAs AMD Xilinx XCV600E-6FG676I, a high-performance integrated circuit designed by AMD Xilinx to meet the demanding needs of modern technology systems. This Field Programmable Gate Array (FPGA) stands out with its capability to support complex digital configurations, catering to a variety of applications that require rapid processing and flexible hardware adjustments. Its robust 676-pin Flip-Chip Ball Grid Array (FCBGA) package ensures durable and reliable integration into any system architecture. The FPGAs AMD Xilinx XCV600E-6FG676I serves as an essential component for developers looking to innovate and optimize technological solutions efficiently.

XCV600E-6FG676I Features

The XCV600E-6FG676I from AMD Xilinx boasts 444 programmable I/O pins, offering extensive versatility for various digital interfaces. Its FPGA design allows for on-the-fly reprogramming which provides adaptability to changing technical requirements. The high pin count supports enhanced connectivity options, facilitating the integration with a multitude of external devices and interfaces, essential for complex designs requiring high-speed data transfers and multiple input/output configurations.

XCV600E-6FG676I Applications

  • Data Centers: Utilized in managing data flow and processing tasks, enhancing server capabilities and efficiency in high-demand environments.
  • Telecommunications: Critical in developing infrastructures for data transmission, including routers and switches, ensuring high-speed communication and reliability.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors, improving safety and driving experiences.
  • Consumer Electronics: Enables high-performance processing in devices such as smartphones and smart TVs, enhancing user interfaces and multimedia handling.
  • Aerospace and Defense: Integral for navigation and control systems requiring high reliability and programmable logic under extreme conditions.
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