XCV600E-6BG432I

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Mfr.Part #
XCV600E-6BG432I
Manufacturer
AMD Xilinx
Package / Case
432-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 316 I/O 432MBGA
Stock
3,928
In Stock :
3,928

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of LABs/CLBs :
3456
Lead Free :
Contains Lead
JESD-30 Code :
S-PBGA-B432
HTS Code :
8542.39.00.01
Number of Gates :
985882
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-609 Code :
e0
Package / Case :
432-LBGA Exposed Pad, Metal
RoHS Status :
Non-RoHS Compliant
RAM Size :
36KB
Width :
40mm
Mounting Type :
Surface Mount
Length :
40mm
Number of Outputs :
316
Number of Terminations :
432
Operating Supply Voltage :
1.8V
Pin Count :
432
Speed Grade :
6
Series :
Virtex®-E
Total RAM Bits :
294912
Peak Reflow Temperature (Cel) :
225
Published :
2006
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
1.8V
Operating Temperature :
-40°C~100°C TJ
Radiation Hardening :
No
Terminal Pitch :
1.27mm
Base Part Number :
XCV600E
Combinatorial Delay of a CLB-Max :
0.47 ns
Mount :
Surface Mount
Voltage - Supply :
1.71V~1.89V
Number of Logic Elements/Cells :
15552
Terminal Position :
BOTTOM
Number of Inputs :
316
Height Seated (Max) :
1.7mm
ECCN Code :
3A991.D
Clock Frequency :
357MHz
Packaging :
Tray
Pbfree Code :
No
Number of I/O :
316
Datasheets
XCV600E-6BG432I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-6BG432I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:432-LBGA Exposed Pad, Metal, Mounting Type:Surface Mount, Number of Terminations:432, Operating Temperature:-40°C~100°C TJ, Base Part Number:XCV600E, XCV600E-6BG432I pinout, XCV600E-6BG432I datasheet PDF, XCV600E-6BG432I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600E-6BG432I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 432-LBGA Exposed Pad, Metal 1.27mm mm 432

XCV600E-6BG432I Overview


In the package 432-LBGA Exposed Pad, Metal, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 316 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 15552 logic elements/cells. Supply voltage is 1.8V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-E series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 316 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 432. Fpga electronics is worth mentioning that this device provides 294912 bfpga electronics s of RAM. XCV600E is the base part number that can be used to identify related parts. The RAM si36kBe of this FPGA module reaches 36kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 3456 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 985882 gates. I am going to present you with a device that is equipped with 432 pins. Fpga semiconductor typically uses a crystal oscillating at 357MHz.

XCV600E-6BG432I Features


316 I/Os
Up to 294912 RAM bits


XCV600E-6BG432I Applications


There are a lot of Xilinx Inc.
XCV600E-6BG432I FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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