XCV600-6FG680C

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Mfr.Part #
XCV600-6FG680C
Manufacturer
AMD Xilinx
Package / Case
680-LBGA Exposed Pad
Datasheet
Download
Description
IC FPGA 512 I/O 680FTEBGA
Stock
34,112
In Stock :
34,112

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Pin Count :
680
RoHS Status :
Non-RoHS Compliant
Lead Free :
Contains Lead
Packaging :
Tray
Number of Logic Elements/Cells :
15552
Width :
40mm
Number of LABs/CLBs :
3456
Base Part Number :
XCV600
Number of Outputs :
512
Number of Terminations :
680
Number of I/O :
512
Number of Gates :
661111
RAM Size :
12kB
Voltage - Supply :
2.375V~2.625V
Length :
40mm
Pbfree Code :
No
Series :
Virtex®
ECCN Code :
EAR99
Power Supplies :
1.2/3.62.5V
Published :
2000
Mount :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish :
Tin/Lead (Sn63Pb37)
Mounting Type :
Surface Mount
Terminal Form :
Ball
Terminal Pitch :
1mm
Total RAM Bits :
98304
JESD-30 Code :
S-PBGA-B680
Height Seated (Max) :
1.7mm
Number of Inputs :
512
HTS Code :
8542.39.00.01
JESD-609 Code :
e0
Clock Frequency :
333MHz
Supply Voltage :
2.5V
Reach Compliance Code :
not_compliant
Peak Reflow Temperature (Cel) :
225
Operating Temperature :
0°C~85°C TJ
Package / Case :
680-LBGA Exposed Pad
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Qualification Status :
Not Qualified
Combinatorial Delay of a CLB-Max :
0.6 ns
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Position :
BOTTOM
Datasheets
XCV600-6FG680C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600-6FG680C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV600, Number of Terminations:680, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:680-LBGA Exposed Pad, XCV600-6FG680C pinout, XCV600-6FG680C datasheet PDF, XCV600-6FG680C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV600-6FG680C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.7mm mm FPGAs Virtex® Series 680-LBGA Exposed Pad 1mm mm 680

XCV600-6FG680C Overview


In the package 680-LBGA Exposed Pad, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 512 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 15552 logic elements/cells. Supply voltage is 2.5V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. This is a type of FPGA that is part of the Virtex® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 512 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 680. Fpga electronics is worth mentioning that this device provides 98304 bfpga electronics s of RAM. XCV600 is the base part number that can be used to identify related parts. The RAM si12kBe of this FPGA module reaches 12kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 3456 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This is a battery operated device that operates on 1.2/3.62.5V. A basic building block for this type of building block consists of 661111 gates. I am going to present you with a device that is equipped with 680 pins. Fpga semiconductor typically uses a crystal oscillating at 333MHz.

XCV600-6FG680C Features


512 I/Os
Up to 98304 RAM bits


XCV600-6FG680C Applications


There are a lot of Xilinx Inc.
XCV600-6FG680C FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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