XCV600-6FG676C
- Mfr.Part #
- XCV600-6FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 444 I/O 676FCBGA
- Stock
- 48,152
- In Stock :
- 48,152
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Qualification Status :
- Not Qualified
- RoHS Status :
- Non-RoHS Compliant
- Number of LABs/CLBs :
- 3456
- Number of I/O :
- 444
- Operating Temperature :
- 0°C~85°C TJ
- Series :
- Virtex®
- Voltage - Supply :
- 2.375V~2.625V
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 2.6mm
- JESD-30 Code :
- S-PBGA-B676
- Pbfree Code :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- ECCN Code :
- EAR99
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Packaging :
- Tray
- Length :
- 27mm
- Number of Terminations :
- 676
- Mount :
- Surface Mount
- Base Part Number :
- XCV600
- Package / Case :
- 676-BBGA, FCBGA
- Total RAM Bits :
- 98304
- Supply Voltage :
- 2.5V
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RAM Size :
- 12kB
- Width :
- 27mm
- JESD-609 Code :
- e0
- Number of Gates :
- 661111
- Number of Outputs :
- 444
- Number of Logic Elements/Cells :
- 15552
- Mounting Type :
- Surface Mount
- Lead Free :
- Contains Lead
- Peak Reflow Temperature (Cel) :
- 225
- Power Supplies :
- 1.2/3.62.5V
- Terminal Pitch :
- 1mm
- Reach Compliance Code :
- not_compliant
- Terminal Position :
- BOTTOM
- Published :
- 2000
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pin Count :
- 676
- Number of Inputs :
- 444
- Clock Frequency :
- 333MHz
- Datasheets
- XCV600-6FG676C

FPGAs AMD Xilinx XCV600-6FG676C Overview
The FPGAs AMD Xilinx XCV600-6FG676C is a high-performance, field-programmable gate array that serves as a versatile backbone for a variety of complex digital applications. This FPGA is designed by AMD Xilinx, a leader in the field of programmable logic devices. The device features a dense array of programmable logic cells encapsulated in a 676-pin Fine-Pitch Ball Grid Array (FCBGA) package, allowing for robust integration into system-on-chip (SoC) solutions. The XCV600-6FG676C is particularly suited for applications requiring high-speed data processing and high I/O bandwidth, providing designers with a flexible and scalable hardware platform that can adapt to evolving technological needs.
XCV600-6FG676C Features
This FPGA boasts 444 programmable I/O ports, which allow for extensive connectivity options and compatibility with a wide range of digital interfaces. Its FCBGA packaging ensures improved thermal management and reduced footprint on the PCB, enhancing the overall reliability and performance of the device. The XCV600-6FG676C's architecture supports rapid prototyping and design iterations, making it an ideal choice for developers looking to expedite time-to-market without sacrificing system functionality or performance.
XCV600-6FG676C Applications
- Data Centers: Utilized in server infrastructure to facilitate high-speed data processing and storage solutions, improving overall efficiency and responsiveness.
- Telecommunications: Deployed in communication equipment to enhance signal processing capabilities and support complex routing algorithms essential for modern telecom networks.
- Aerospace and Defense: Integrated into avionics and satellite systems for navigation, communication, and surveillance applications, ensuring robust and reliable performance in harsh environments.
- Medical Imaging: Used in medical diagnostic equipment such as MRI and CT scanners to process complex imaging data, providing clearer and more accurate results.
- Industrial Automation: Applied in control systems for manufacturing lines to increase automation and precision, leading to higher productivity and safety.
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