XCV400E-8BG560C

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Mfr.Part #
XCV400E-8BG560C
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
23,778
In Stock :
23,778

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
1.71V~1.89V
Published :
1999
Package / Case :
560-LBGA Exposed Pad, Metal
Base Part Number :
XCV400E
Time@Peak Reflow Temperature-Max (s) :
30
Radiation Hardening :
No
Total RAM Bits :
163840
Peak Reflow Temperature (Cel) :
225
Height Seated (Max) :
1.7mm
JESD-30 Code :
S-PBGA-B560
Number of Inputs :
404
Length :
42.5mm
RAM Size :
20kB
Number of Equivalent Gates :
129600
Terminal Pitch :
1.27mm
Speed Grade :
8
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
42.5mm
Mounting Type :
Surface Mount
Pbfree Code :
No
Terminal Form :
Ball
Number of I/O :
404
Clock Frequency :
416MHz
Number of Terminations :
560
Pin Count :
560
Operating Supply Voltage :
1.8V
Number of Logic Elements/Cells :
10800
Combinatorial Delay of a CLB-Max :
0.4 ns
Number of LABs/CLBs :
2400
Number of Outputs :
404
Terminal Position :
BOTTOM
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e0
Operating Temperature :
0°C~85°C TJ
Mount :
Surface Mount
Packaging :
Tray
Lead Free :
Contains Lead
Number of Gates :
569952
Terminal Finish :
Tin/Lead (Sn63Pb37)
RoHS Status :
Non-RoHS Compliant
Series :
Virtex®-E
ECCN Code :
3A991.D
Supply Voltage :
1.8V
Datasheets
XCV400E-8BG560C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV400E-8BG560C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:560-LBGA Exposed Pad, Metal, Base Part Number:XCV400E, Mounting Type:Surface Mount, Number of Terminations:560, Operating Temperature:0°C~85°C TJ, XCV400E-8BG560C pinout, XCV400E-8BG560C datasheet PDF, XCV400E-8BG560C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV400E-8BG560C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV400E-8BG560C Overview


In the 560-LBGA Exposed Pad, Metal package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 404 I/O ports for more coherent data transfer. To form a fundamental building block, there are 10800 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.8V volts is required. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.71V~1.89V-volt supply voltage required for the device to operate. The Virtex®-E Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. A total of 404 outputs are incorporated into this device. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. 560 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 163840 bFpga chipss. You can find related parts by using the part number XCV400E, which is its base part number. It is crucial that the RAM si20kBe of this FPGA module reaches 20kB so that the program can run normally. A total of 2400 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.8V. There are 569952 gates in its basic building block. With a total of 560 pins, it is equipped with a high level of security. It usually uses a 416MHz crystal. This design is implemented using 129600 equivalent gates on the FPGA.

XCV400E-8BG560C Features


404 I/Os
Up to 163840 RAM bits


XCV400E-8BG560C Applications


There are a lot of Xilinx Inc.
XCV400E-8BG560C FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
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