XCV400-4BG560I

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Mfr.Part #
XCV400-4BG560I
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
4,360
In Stock :
4,360

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
81920
JESD-30 Code :
S-PBGA-B560
JESD-609 Code :
e0
RAM Size :
10kB
Base Part Number :
XCV400
Height Seated (Max) :
1.7mm
Supply Voltage :
2.5V
Lead Free :
Contains Lead
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Virtex®
Operating Supply Voltage :
2.5V
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of Outputs :
404
Time@Peak Reflow Temperature-Max (s) :
30
Voltage - Supply :
2.375V~2.625V
Radiation Hardening :
No
Package / Case :
560-LBGA Exposed Pad, Metal
Peak Reflow Temperature (Cel) :
225
Number of Gates :
468252
Number of Terminations :
560
Pbfree Code :
No
Number of I/O :
404
Number of Logic Elements/Cells :
10800
Terminal Pitch :
1.27mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Form :
Ball
Mounting Type :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.8 ns
Packaging :
Tray
Number of Inputs :
404
Clock Frequency :
250MHz
Operating Temperature :
-40°C~100°C TJ
Mount :
Surface Mount
Speed Grade :
4
Number of LABs/CLBs :
2400
ECCN Code :
3A991.D
Published :
2000
Terminal Position :
BOTTOM
Pin Count :
560
RoHS Status :
Non-RoHS Compliant
Datasheets
XCV400-4BG560I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV400-4BG560I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV400, Package / Case:560-LBGA Exposed Pad, Metal, Number of Terminations:560, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, XCV400-4BG560I pinout, XCV400-4BG560I datasheet PDF, XCV400-4BG560I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV400-4BG560I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



2.5V V 1.7mm mm FPGAs Virtex® Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV400-4BG560I Overview


A 560-LBGA Exposed Pad, Metal package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 404 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 10800 logic elements/cells. An electrical supply voltage of 2.5V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 2.375V~2.625V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Virtex® series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. In order to make this device as versatile as possible, there are 404 different outputs included. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 560 terminations. The RAM bits that are offered by this fpga chips are 81920. Related parts can be found by using its base part number XCV400. The FPGA module's RAM si10kBe reaches 10kB in order to ensure that the program operates in a normal manner. Fpga electronics contains 2400 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 2.5V-volt supply allows designers to fully utilize its flexibility. Among its basic building blocks, there are 468252 gates that are included in it. In addition to this, it has 560 pins. Normally, fpga semiconductor uses an oscillator, which oscillates at 250MHz, to create the signal.

XCV400-4BG560I Features


404 I/Os
Up to 81920 RAM bits


XCV400-4BG560I Applications


There are a lot of Xilinx Inc.
XCV400-4BG560I FPGAs applications.


  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
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