XCV400E-7FG676C
- Mfr.Part #
- XCV400E-7FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 404 I/O 676FCBGA
- Stock
- 21,586
- In Stock :
- 21,586
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Pbfree Code :
- No
- Mount :
- Surface Mount
- HTS Code :
- 8542.39.00.01
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- 225
- Package / Case :
- 676-BBGA, FCBGA
- JESD-609 Code :
- e0
- Series :
- Virtex®-E
- Terminal Pitch :
- 1mm
- Number of Logic Elements/Cells :
- 10800
- RoHS Status :
- Non-RoHS Compliant
- Number of LABs/CLBs :
- 2400
- Terminal Form :
- Ball
- Number of Gates :
- 569952
- Number of I/O :
- 404
- Operating Temperature :
- 0°C~85°C TJ
- Number of Terminations :
- 676
- Number of Equivalent Gates :
- 129600
- Operating Supply Voltage :
- 1.8V
- Total RAM Bits :
- 163840
- Voltage - Supply :
- 1.71V~1.89V
- Speed Grade :
- 7
- Packaging :
- Tray
- Base Part Number :
- XCV400E
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max) :
- 2.6mm
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 404
- Clock Frequency :
- 400MHz
- RAM Size :
- 20kB
- ECCN Code :
- 3A991.D
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 1.8V
- Number of Pins :
- 676
- Combinatorial Delay of a CLB-Max :
- 0.42 ns
- Pin Count :
- 676
- Radiation Hardening :
- No
- Published :
- 1999
- Lead Free :
- Contains Lead
- Datasheets
- XCV400E-7FG676C
XCV400E-7FG676C Documents

FPGAs AMD Xilinx XCV400E-7FG676C Overview
The FPGAs AMD Xilinx XCV400E-7FG676C is a highly capable field programmable gate array that offers an optimal balance of power, flexibility, and performance for a diverse range of applications. Manufactured by AMD Xilinx, this component is designed to cater to high-demand computing environments requiring robust programmability and functionality. With 404 I/O pins housed in a 676-pin flip-chip ball grid array (FCBGA) package, the XCV400E-7FG676C excels in complex digital processing tasks, enabling engineers and designers to push the boundaries of what's possible in electronic design.
XCV400E-7FG676C Features
This FPGA offers a robust suite of features, including a high I/O pin count which facilitates versatile interfacing with multiple peripherals and other ICs. The 676FCBGA packaging ensures a reliable and compact design that can fit into various hardware configurations, supporting efficient heat dissipation and enhanced signal integrity. These attributes make the XCV400E-7FG676C an ideal choice for sophisticated, multi-functional digital circuits.
XCV400E-7FG676C Applications
- Telecommunications Equipment: Used in routers and switches, facilitating high-speed data transmission and advanced signal processing capabilities.
- Automotive Systems: Integrates into driver assistance systems, contributing to real-time processing for sensors and imaging applications.
- Consumer Electronics: Empowers smart home devices and high-performance gaming consoles with its ability to handle complex user interfaces and multimedia processing.
- Industrial Automation: Crucial in the control systems for real-time operations and machine-to-machine communications, enhancing operational efficiency and reliability.
- Medical Devices: Applied in diagnostic and imaging equipment, enabling precise and quick processing of complex biomedical data.
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