XCV400E-6FG676C

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Mfr.Part #
XCV400E-6FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 404 I/O 676FCBGA
Stock
31,720
In Stock :
31,720

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Number of I/O :
404
Packaging :
Tray
Combinatorial Delay of a CLB-Max :
0.47 ns
Operating Temperature :
0°C~85°C TJ
Pin Count :
676
Number of Outputs :
404
Base Part Number :
XCV400E
Radiation Hardening :
No
Number of Logic Elements/Cells :
10800
Total RAM Bits :
163840
Peak Reflow Temperature (Cel) :
225
Terminal Pitch :
1mm
Length :
27mm
JESD-609 Code :
e0
Terminal Form :
Ball
Supply Voltage :
1.8V
Number of Pins :
676
Voltage - Supply :
1.71V~1.89V
Operating Supply Voltage :
1.8V
Number of LABs/CLBs :
2400
Clock Frequency :
357MHz
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Pbfree Code :
No
Series :
Virtex®-E
Time@Peak Reflow Temperature-Max (s) :
30
Number of Gates :
569952
RAM Size :
20kB
Number of Terminations :
676
Published :
2006
Mount :
Surface Mount
HTS Code :
8542.39.00.01
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
676-BBGA, FCBGA
ECCN Code :
3A991.D
Width :
27mm
Lead Free :
Contains Lead
Speed Grade :
6
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV400E-6FG676C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Base Part Number:XCV400E, Number of Pins:676, Mounting Type:Surface Mount, Number of Terminations:676, Package / Case:676-BBGA, FCBGA, XCV400E-6FG676C pinout, XCV400E-6FG676C datasheet PDF, XCV400E-6FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV400E-6FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV400E-6FG676C


FPGAs AMD Xilinx XCV400E-6FG676C Overview

The AMD Xilinx XCV400E-6FG676C FPGA is a highly versatile and powerful component designed for applications requiring high-speed, reliable digital logic processing. This IC FPGA features a dense 676-pin FCBGA (Fine-pitch Ball Grid Array) package, facilitating a robust physical interface and enhancing thermal characteristics, which are crucial for high-performance operations. It supports a broad range of I/O standards, making it highly adaptable to various digital environments. With 404 I/O ports, this FPGA provides ample connectivity for complex digital systems, ensuring efficient data handling and integration in multi-component setups. The FPGA is crafted to meet the rigorous demands of modern digital applications, delivering exceptional performance and flexibility.

XCV400E-6FG676C Features

The AMD Xilinx XCV400E-6FG676C FPGA includes several features that make it an excellent choice for demanding applications. Key features include its 404 I/O ports, which support multiple configurations for maximum versatility, and its 676FCBGA packaging that ensures reliable electrical connectivity and enhanced thermal management. The device's architecture is optimized for rapid prototyping and complex FPGA development tasks, allowing designers to accelerate their time-to-market with efficient design cycles.

XCV400E-6FG676C Applications

  • Telecommunications Equipment: Used in routers and switches to manage data flow efficiently across networks.
  • Automotive Electronics: Integral for driver assistance systems where rapid signal processing is essential.
  • Industrial Automation: Empowers control systems in manufacturing processes for increased productivity and safety.
  • Consumer Electronics: Provides the processing power needed for high-performance consumer devices like smart TVs and gaming consoles.
  • Medical Devices: Enhances functionality and reliability in critical medical imaging and diagnostic equipment.
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