XCV400-6FG676C

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Mfr.Part #
XCV400-6FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 404 I/O 676FCBGA
Stock
46,942
In Stock :
46,942

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Inputs :
404
Combinatorial Delay of a CLB-Max :
0.6 ns
ECCN Code :
EAR99
Number of LABs/CLBs :
2400
Peak Reflow Temperature (Cel) :
225
RAM Size :
10kB
Number of Outputs :
404
JESD-609 Code :
e0
Terminal Finish :
Tin/Lead (Sn63Pb37)
Operating Temperature :
0°C~85°C TJ
Lead Free :
Contains Lead
Base Part Number :
XCV400
Width :
27mm
Mount :
Surface Mount
Packaging :
Tray
HTS Code :
8542.39.00.01
Total RAM Bits :
81920
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Pin Count :
676
Power Supplies :
1.2/3.62.5V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
404
Qualification Status :
Not Qualified
Package / Case :
676-BBGA, FCBGA
Published :
2000
Number of Gates :
468252
JESD-30 Code :
S-PBGA-B676
Pbfree Code :
No
Terminal Form :
Ball
Voltage - Supply :
2.375V~2.625V
Time@Peak Reflow Temperature-Max (s) :
30
Number of Terminations :
676
Clock Frequency :
333MHz
Series :
Virtex®
RoHS Status :
Non-RoHS Compliant
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Length :
27mm
Height Seated (Max) :
2.6mm
Supply Voltage :
2.5V
Number of Logic Elements/Cells :
10800
Terminal Position :
BOTTOM
Reach Compliance Code :
not_compliant
Datasheets
XCV400-6FG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV400-6FG676C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Base Part Number:XCV400, Package / Case:676-BBGA, FCBGA, Number of Terminations:676, Mounting Type:Surface Mount, XCV400-6FG676C pinout, XCV400-6FG676C datasheet PDF, XCV400-6FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV400-6FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV400-6FG676C


FPGAs AMD Xilinx XCV400-6FG676C Overview

The AMD Xilinx XCV400-6FG676C is a state-of-the-art Field Programmable Gate Array (FPGA) that epitomizes versatility and efficiency in a compact form factor. Designed to cater to a broad spectrum of applications, this FPGA combines a high I/O pin count and a dense 676-pin flip-chip BGA (FCBGA) package, making it an ideal solution for intricate digital logic operations. With its robust configuration and adaptable logic blocks, the FPGAs AMD Xilinx XCV400-6FG676C facilitates rapid prototyping and development across various industries, ensuring a quick turn-around from concept to market. Its superior performance metrics are tailored to meet the demands of high-speed digital processing tasks, providing designers with a flexible and powerful computing resource.

XCV400-6FG676C Features

The XCV400-6FG676C FPGA boasts an array of features that make it a top choice for developers and engineers looking for advanced system integration. It offers 404 programmable I/O ports that allow for versatile interfacing with other digital components. The FPGA's architecture supports extensive logic operations, facilitating complex algorithm implementations without sacrificing speed or efficiency. Moreover, the compact 676-pin FCBGA package ensures that it can be integrated into space-constrained applications while still providing the connectivity and capabilities expected of a leading-edge technology component.

XCV400-6FG676C Applications

  • Telecommunications Equipment: Utilizes its high I/O capabilities to manage data flows and signal processing, enhancing the efficiency and reliability of communications systems.
  • Automotive Electronics: Employs its robust processing power to support advanced driver-assistance systems (ADAS), ensuring real-time data processing and reliability in critical safety functions.
  • Industrial Automation: Takes advantage of the FPGA’s adaptability to control machinery and industrial processes, increasing the precision and automation capabilities in manufacturing environments.
  • Consumer Electronics: Supports high-definition video processing and complex digital consumer products, providing the necessary processing power for multimedia devices and home entertainment systems.
  • Medical Devices: Facilitates the development of sophisticated medical imaging and diagnostic equipment by handling complex computations and signal integrity, crucial for high-accuracy medical analyses.
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