XCS40XL-5BG256C
- Mfr.Part #
- XCS40XL-5BG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BBGA
- Datasheet
- Download
- Description
- IC FPGA 205 I/O 256BGA
- Stock
- 39,936
- In Stock :
- 39,936
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- Package / Case :
- 256-BBGA
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Pin Count :
- 256
- Number of Logic Cells :
- 784
- JESD-609 Code :
- e0
- Number of LABs/CLBs :
- 784
- Terminal Form :
- Ball
- Number of I/O :
- 205
- Number of Outputs :
- 205
- Number of Terminations :
- 256
- HTS Code :
- 8542.39.00.01
- RoHS Status :
- Non-RoHS Compliant
- Number of CLBs :
- 784
- Power Supplies :
- 3.3V
- Number of Pins :
- 256
- Height Seated (Max) :
- 2.55mm
- Number of Equivalent Gates :
- 13000
- Total RAM Bits :
- 25088
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1.27mm
- Supply Voltage :
- 3.3V
- Length :
- 27mm
- Clock Frequency :
- 250MHz
- Combinatorial Delay of a CLB-Max :
- 1 ns
- Peak Reflow Temperature (Cel) :
- 225
- Number of Logic Elements/Cells :
- 1862
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 3V~3.6V
- Width :
- 27mm
- ECCN Code :
- EAR99
- Mount :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Reach Compliance Code :
- not_compliant
- Lead Free :
- Contains Lead
- Series :
- Spartan®-XL
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Gates :
- 40000
- Base Part Number :
- XCS40XL
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- RAM Size :
- 3.1kB
- Qualification Status :
- Not Qualified
- Published :
- 1999
- Datasheets
- XCS40XL-5BG256C
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FPGAs AMD Xilinx XCS40XL-5BG256C Overview
The AMD Xilinx XCS40XL-5BG256C FPGA is a highly capable component designed for advanced digital processing and versatile applications. This particular model from AMD Xilinx, a leader in the field of programmable logic devices, combines high performance with low power consumption, making it an ideal choice for developers looking to push the boundaries of technology. The XCS40XL-5BG256C is crafted in a compact 256-ball BGA (Ball Grid Array) package, offering a robust platform for sophisticated circuit designs and enhancing system reliability. Its adaptability and performance parameters make it a preferred option for industries seeking to implement intricate logic operations and system integration in a scalable fashion.
XCS40XL-5BG256C Features
This FPGA model boasts 205 user I/O pins, allowing for extensive connectivity and interface options with other components in a system. The high I/O count is perfect for applications requiring multiple data streams or high-bandwidth data processing. The device is engineered in a 256BGA package, ensuring reduced footprint and enhanced thermal management, which is crucial for maintaining system stability and efficiency under varying operational conditions.
XCS40XL-5BG256C Applications
- Telecommunications Equipment: The XCS40XL-5BG256C can be used to manage signal processing and data flow in complex telecommunications infrastructure, improving bandwidth efficiency and system responsiveness.
- Industrial Automation: This FPGA serves as a control center in automated production lines, facilitating real-time processing and decision-making that enhance operational accuracy and speed.
- Consumer Electronics: In consumer devices, the XCS40XL-5BG256C enhances functionality by supporting advanced user interfaces and multimedia processing, thus improving the user experience.
- Aerospace and Defense: The robust design and high I/O capacity make it suitable for applications in aerospace and defense, where reliability and precision are paramount.
- Medical Devices: It is applied in medical imaging systems, where its processing power helps in delivering clearer images and faster diagnostic capabilities.
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