XCS40-3BG256C

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Mfr.Part #
XCS40-3BG256C
Manufacturer
AMD Xilinx
Package / Case
256-BBGA
Datasheet
Download
Description
IC FPGA 205 I/O 256BGA
Stock
12,266
In Stock :
12,266

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
Spartan®
Number of Pins :
256
Power Supplies :
5V
Number of Outputs :
205
Terminal Pitch :
1.27mm
Packaging :
Tray
Lead Free :
Contains Lead
Speed Grade :
3
Published :
1999
Pin Count :
256
Base Part Number :
XCS40
RoHS Status :
Non-RoHS Compliant
Package / Case :
256-BBGA
JESD-609 Code :
e0
Peak Reflow Temperature (Cel) :
225
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
125MHz
ECCN Code :
EAR99
Number of CLBs :
784
Operating Temperature :
0°C~85°C TJ
Mount :
Surface Mount
Number of Terminations :
256
Number of Logic Elements/Cells :
1862
Mounting Type :
Surface Mount
Terminal Position :
BOTTOM
Operating Supply Voltage :
5V
Number of I/O :
205
Number of Registers :
2016
Length :
27mm
Combinatorial Delay of a CLB-Max :
1.6 ns
Number of Gates :
40000
Width :
27mm
Supply Voltage :
5V
Number of Logic Cells :
784
Total RAM Bits :
25088
Height Seated (Max) :
2.55mm
Voltage - Supply :
4.75V~5.25V
Number of LABs/CLBs :
784
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Radiation Hardening :
No
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RAM Size :
3.1kB
Datasheets
XCS40-3BG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCS40-3BG256C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:256, Base Part Number:XCS40, Package / Case:256-BBGA, Operating Temperature:0°C~85°C TJ, Number of Terminations:256, Mounting Type:Surface Mount, XCS40-3BG256C pinout, XCS40-3BG256C datasheet PDF, XCS40-3BG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCS40-3BG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCS40-3BG256C


FPGAs AMD Xilinx XCS40-3BG256C Overview

The FPGAs AMD Xilinx XCS40-3BG256C is a high-performance Field Programmable Gate Array designed to meet the demanding needs of modern digital circuits. This versatile FPGA from AMD Xilinx features a robust architecture that supports a wide range of applications, making it an ideal choice for developers and engineers looking for a reliable solution to complex design challenges. With 205 I/O pins and housed in a compact 256BGA package, this FPGA offers flexibility and scalability, facilitating advanced integration into technology systems while maintaining a small footprint.

XCS40-3BG256C Features

The XCS40-3BG256C FPGA boasts several key features that enhance its performance and utility in complex electronic systems. This includes a high I/O pin count for extensive peripheral interfacing, a dense BGA package that ensures minimal space utilization on circuit boards, and advanced configuration options that allow for highly customized implementations tailored to specific project requirements.

XCS40-3BG256C Applications

  • Telecommunications Equipment: The FPGA's high I/O flexibility and capacity for managing multiple data streams make it perfect for integrating into telecommunications infrastructure, enhancing data transmission capabilities.
  • Automotive Electronics: In automotive systems, the XCS40-3BG256C can control and process multiple sensor inputs, contributing to advanced driver-assistance systems (ADAS) and in-vehicle infotainment technologies.
  • Consumer Electronics: This FPGA is utilized in high-definition video processing devices, such as digital TVs and gaming consoles, where rapid data processing is essential.
  • Industrial Automation: Its robust processing power supports the demands of industrial automation systems, facilitating enhanced control and efficiency in manufacturing processes.
  • Aerospace and Defense: The reliability and configurability of the XCS40-3BG256C make it suitable for aerospace applications, where precision and durability are critical.
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