XCS40-3BG256C
- Mfr.Part #
- XCS40-3BG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BBGA
- Datasheet
- Download
- Description
- IC FPGA 205 I/O 256BGA
- Stock
- 12,266
- In Stock :
- 12,266
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- Spartan®
- Number of Pins :
- 256
- Power Supplies :
- 5V
- Number of Outputs :
- 205
- Terminal Pitch :
- 1.27mm
- Packaging :
- Tray
- Lead Free :
- Contains Lead
- Speed Grade :
- 3
- Published :
- 1999
- Pin Count :
- 256
- Base Part Number :
- XCS40
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 256-BBGA
- JESD-609 Code :
- e0
- Peak Reflow Temperature (Cel) :
- 225
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Clock Frequency :
- 125MHz
- ECCN Code :
- EAR99
- Number of CLBs :
- 784
- Operating Temperature :
- 0°C~85°C TJ
- Mount :
- Surface Mount
- Number of Terminations :
- 256
- Number of Logic Elements/Cells :
- 1862
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 5V
- Number of I/O :
- 205
- Number of Registers :
- 2016
- Length :
- 27mm
- Combinatorial Delay of a CLB-Max :
- 1.6 ns
- Number of Gates :
- 40000
- Width :
- 27mm
- Supply Voltage :
- 5V
- Number of Logic Cells :
- 784
- Total RAM Bits :
- 25088
- Height Seated (Max) :
- 2.55mm
- Voltage - Supply :
- 4.75V~5.25V
- Number of LABs/CLBs :
- 784
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Form :
- Ball
- Radiation Hardening :
- No
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RAM Size :
- 3.1kB
- Datasheets
- XCS40-3BG256C
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FPGAs AMD Xilinx XCS40-3BG256C Overview
The FPGAs AMD Xilinx XCS40-3BG256C is a high-performance Field Programmable Gate Array designed to meet the demanding needs of modern digital circuits. This versatile FPGA from AMD Xilinx features a robust architecture that supports a wide range of applications, making it an ideal choice for developers and engineers looking for a reliable solution to complex design challenges. With 205 I/O pins and housed in a compact 256BGA package, this FPGA offers flexibility and scalability, facilitating advanced integration into technology systems while maintaining a small footprint.
XCS40-3BG256C Features
The XCS40-3BG256C FPGA boasts several key features that enhance its performance and utility in complex electronic systems. This includes a high I/O pin count for extensive peripheral interfacing, a dense BGA package that ensures minimal space utilization on circuit boards, and advanced configuration options that allow for highly customized implementations tailored to specific project requirements.
XCS40-3BG256C Applications
- Telecommunications Equipment: The FPGA's high I/O flexibility and capacity for managing multiple data streams make it perfect for integrating into telecommunications infrastructure, enhancing data transmission capabilities.
- Automotive Electronics: In automotive systems, the XCS40-3BG256C can control and process multiple sensor inputs, contributing to advanced driver-assistance systems (ADAS) and in-vehicle infotainment technologies.
- Consumer Electronics: This FPGA is utilized in high-definition video processing devices, such as digital TVs and gaming consoles, where rapid data processing is essential.
- Industrial Automation: Its robust processing power supports the demands of industrial automation systems, facilitating enhanced control and efficiency in manufacturing processes.
- Aerospace and Defense: The reliability and configurability of the XCS40-3BG256C make it suitable for aerospace applications, where precision and durability are critical.
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