XCKU5P-L2FFVB676E
- Mfr.Part #
- XCKU5P-L2FFVB676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 280 I/O 676FCBGA
- Stock
- 20,612
- In Stock :
- 20,612
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Total RAM Bits :
- 41984000
- Mounting Type :
- Surface Mount
- Package / Case :
- 676-BBGA, FCBGA
- Factory Lead Time :
- 11 Weeks
- Operating Temperature :
- 0°C~110°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Voltage - Supply :
- 0.698V~0.876V
- Number of Logic Elements/Cells :
- 474600
- HTS Code :
- 8542.39.00.01
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Packaging :
- Tray
- Series :
- Kintex® UltraScale+™
- Number of I/O :
- 280
- Number of LABs/CLBs :
- 27120
- Datasheets
- XCKU5P-L2FFVB676E

FPGAs AMD Xilinx XCKU5P-L2FFVB676E Overview
The AMD Xilinx XCKU5P-L2FFVB676E represents a highly versatile FPGA from the Xilinx Kintex® UltraScale™ product family, designed for a broad range of applications requiring optimal balance between power and performance. This device integrates advanced technology to handle complex digital processing tasks with remarkable efficiency and reliability. Its 676-pin flip-chip ball grid array (FCBGA) packaging ensures a compact footprint while providing a robust 280 I/O options for diverse connectivity possibilities. Ideal for demanding industrial, data processing, and telecommunication environments, the XCKU5P-L2FFVB676E FPGA enables designers to create high-performance, multifunctional digital products.
XCKU5P-L2FFVB676E Features
The XCKU5P-L2FFVB676E FPGA boasts an impressive array of features suitable for high-demand applications. Key features include its substantial logic cells, high-speed transceivers, and flexible memory options. Its advanced interconnect technology optimizes data throughput and minimizes latency, making it an excellent choice for complex digital integrations. The chip's power efficiency is enhanced by AMD Xilinx's innovative clock management technology, which includes integrated DSP slices for optimized processing power.
XCKU5P-L2FFVB676E Applications
- Telecommunications Equipment: Utilized in routers and switches, the XCKU5P-L2FFVB676E enhances signal integrity and data flow efficiency through its high-speed transceivers and extensive I/O capabilities.
- Data Centers: Improves data processing capabilities in servers and storage solutions, supporting high data throughput and reduced latency for cloud computing environments.
- Medical Imaging: Its powerful DSP slices and high computation abilities make it ideal for handling the complex algorithms needed in medical imaging devices like MRI and CT scanners.
- Automotive: Employed in driver assistance systems (ADAS), the FPGA's robust processing power and connectivity options help to process and relay critical data from vehicle sensors to assistive technologies efficiently.
- Aerospace: In avionics, the FPGA supports critical navigation and control systems by ensuring fast data processing and reliable operation under extreme conditions.
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