XCKU3P-2FFVA676I
- Mfr.Part #
- XCKU3P-2FFVA676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 256 I/O 676FCBGA
- Stock
- 1,980
- In Stock :
- 1,980
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Factory Lead Time :
- 11 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 0.825V~0.876V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package / Case :
- 676-BBGA, FCBGA
- Total RAM Bits :
- 31641600
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 355950
- Series :
- Kintex® UltraScale+™
- Operating Temperature :
- -40°C~100°C TJ
- Number of I/O :
- 256
- Mounting Type :
- Surface Mount
- Number of LABs/CLBs :
- 20340
- Datasheets
- XCKU3P-2FFVA676I

FPGAs AMD Xilinx XCKU3P-2FFVA676I Overview
The FPGAs AMD Xilinx XCKU3P-2FFVA676I is a highly advanced integrated circuit specifically designed for applications requiring high-speed processing and flexible configuration options. Manufactured by AMD Xilinx, this FPGA features a dense arrangement of logic blocks and a versatile 676-pin flip-chip ball grid array (FCBGA) package, providing a robust platform for complex digital systems. This product is ideal for developers looking to harness superior performance for intricate computations and data handling in a compact form factor. With its extensive I/O capabilities, it offers ample flexibility for a wide range of industrial and technological applications, making it a preferred choice for high-volume B2B procurement.
XCKU3P-2FFVA676I Features
This FPGA is equipped with 256 I/O ports, facilitating extensive connectivity and interfacing options. The compact 676FCBGA packaging not only ensures a minimal footprint on system boards but also enhances thermal management and signal integrity. Its robust design is engineered to meet the demands of high-speed digital processing, supporting various configuration schemes to cater to specific application needs and innovations.
XCKU3P-2FFVA676I Applications
- Data Centers: Utilized in server farms for accelerating processing tasks, managing large-scale data transactions, and improving overall efficiency and performance of storage solutions.
- Telecommunications: Employed in communication infrastructure to enhance signal processing capabilities, support high-speed data transmission, and facilitate network management and scalability.
- Automotive: Integral in advanced driver-assistance systems (ADAS) for processing multiple real-time inputs, enhancing vehicle safety and performance.
- Aerospace: Used in flight control systems to handle complex algorithms and multiple control surface variables with high reliability and precision.
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