XCKU3P-2FFVA676I

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Mfr.Part #
XCKU3P-2FFVA676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 256 I/O 676FCBGA
Stock
1,980
In Stock :
1,980

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Factory Lead Time :
11 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
HTS Code :
8542.39.00.01
Packaging :
Tray
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
0.825V~0.876V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Package / Case :
676-BBGA, FCBGA
Total RAM Bits :
31641600
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
355950
Series :
Kintex® UltraScale+™
Operating Temperature :
-40°C~100°C TJ
Number of I/O :
256
Mounting Type :
Surface Mount
Number of LABs/CLBs :
20340
Datasheets
XCKU3P-2FFVA676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2FFVA676I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, XCKU3P-2FFVA676I pinout, XCKU3P-2FFVA676I datasheet PDF, XCKU3P-2FFVA676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2FFVA676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU3P-2FFVA676I


FPGAs AMD Xilinx XCKU3P-2FFVA676I Overview

The FPGAs AMD Xilinx XCKU3P-2FFVA676I is a highly advanced integrated circuit specifically designed for applications requiring high-speed processing and flexible configuration options. Manufactured by AMD Xilinx, this FPGA features a dense arrangement of logic blocks and a versatile 676-pin flip-chip ball grid array (FCBGA) package, providing a robust platform for complex digital systems. This product is ideal for developers looking to harness superior performance for intricate computations and data handling in a compact form factor. With its extensive I/O capabilities, it offers ample flexibility for a wide range of industrial and technological applications, making it a preferred choice for high-volume B2B procurement.

XCKU3P-2FFVA676I Features

This FPGA is equipped with 256 I/O ports, facilitating extensive connectivity and interfacing options. The compact 676FCBGA packaging not only ensures a minimal footprint on system boards but also enhances thermal management and signal integrity. Its robust design is engineered to meet the demands of high-speed digital processing, supporting various configuration schemes to cater to specific application needs and innovations.

XCKU3P-2FFVA676I Applications

  • Data Centers: Utilized in server farms for accelerating processing tasks, managing large-scale data transactions, and improving overall efficiency and performance of storage solutions.
  • Telecommunications: Employed in communication infrastructure to enhance signal processing capabilities, support high-speed data transmission, and facilitate network management and scalability.
  • Automotive: Integral in advanced driver-assistance systems (ADAS) for processing multiple real-time inputs, enhancing vehicle safety and performance.
  • Aerospace: Used in flight control systems to handle complex algorithms and multiple control surface variables with high reliability and precision.
This HTML structured content emphasizes the versatility and high performance of the XCKU3P-2FFVA676I, ensuring it's presented in a manner appealing to technical B2B customers and clearly outlines practical applications that highlight the FPGA's adaptability and strength in various demanding fields.
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