XCAU25P-2FFVB676I

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Mfr.Part #
XCAU25P-2FFVB676I
Manufacturer
AMD Xilinx
Package / Case
BGA-676
Datasheet
Download
Description
IC FPGA ARTIX UP 676FCBGA
Stock
38,012
In Stock :
38,012

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Supplier Device Package :
676-FCBGA (27x27)
Product Status :
Active
Package :
Tray
Number of Logic Elements/Cells :
308437
Data Rate :
6 Gb/s
Voltage - Supply :
0.825V ~ 0.876V
Minimum Operating Temperature :
- 40 C
Number of I/Os :
292 I/O
Total RAM Bits :
11010048
Series :
XCAU25P
Package / Case :
BGA-676
Number of Transceivers :
12 Transceiver
Mounting Style :
SMD/SMT
Operating Supply Voltage :
850 mV
Number of LABs/CLBs :
17625
Number of I/O :
280
Operating Temperature :
-40°C ~ 100°C (TJ)
Mounting Type :
Surface Mount
Maximum Operating Temperature :
+ 100 C
Datasheets
XCAU25P-2FFVB676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCAU25P-2FFVB676I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:BGA-676, Operating Temperature:-40°C ~ 100°C (TJ), Mounting Type:Surface Mount, XCAU25P-2FFVB676I pinout, XCAU25P-2FFVB676I datasheet PDF, XCAU25P-2FFVB676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCAU25P-2FFVB676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCAU25P-2FFVB676I


FPGAs AMD Xilinx XCAU25P-2FFVB676I Overview

The FPGAs AMD Xilinx XCAU25P-2FFVB676I is a high-performance, Artix UltraScale FPGA designed to meet the demanding needs of modern technology applications. This component from AMD Xilinx leverages advanced 14nm technology to provide a perfect balance between power efficiency and processing capability, making it an ideal choice for developers and engineers looking for robust hardware solutions for their complex designs. As a market leader in programmable logic devices, AMD Xilinx ensures that this FPGA delivers not only superior performance but also offers increased system integration and flexibility in design adjustments.

XCAU25P-2FFVB676I Features

This particular model comes in a 676-pin FCBGA (Flip-Chip Ball Grid Array) package that provides a compact footprint while allowing for efficient thermal management and reduced power consumption. It features integrated DSP (Digital Signal Processing) slices for advanced signal manipulation, high-speed transceivers for excellent data transmission rates, and ample logic cells to handle intricate computational tasks. Enhanced security measures are also incorporated to ensure data integrity and secure operations in sensitive applications.

XCAU25P-2FFVB676I Applications

  • Telecommunications Equipment: Utilized for its high-speed transceivers and signal processing capabilities, improving data flow and reliability in network hardware.
  • Consumer Electronics: Integrates into devices such as high-definition televisions and gaming consoles, providing support for intricate graphics and real-time processing needs.
  • Automotive Systems: Employs its robust processing power to enhance functionality in advanced driver-assistance systems (ADAS), increasing safety and vehicle performance.
  • Industrial Automation: Ideal for control systems in manufacturing processes, enhancing operational efficiency and reliability through its extensive I/O capabilities and adaptable logic configuration.
  • Medical Devices: Supports critical applications in medical imaging and diagnostic equipment, ensuring precise and reliable processing for patient care.
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