XCAU10P-1FFVB676I
- Mfr.Part #
- XCAU10P-1FFVB676I
- Manufacturer
- AMD Xilinx
- Package / Case
- BGA-676
- Datasheet
- Download
- Description
- IC FPGA ARTIXUP 676BGA
- Stock
- 4,844
- In Stock :
- 4,844
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of I/Os :
- 240 I/O
- Number of Logic Elements/Cells :
- 96250
- Number of Transceivers :
- 12 Transceiver
- Data Rate :
- 6 Gb/s
- Supplier Device Package :
- 676-FCBGA (27x27)
- Package :
- Tray
- Operating Supply Voltage :
- 850 mV
- Product Status :
- Active
- Total RAM Bits :
- 3670016
- Maximum Operating Temperature :
- + 100 C
- Minimum Operating Temperature :
- - 40 C
- Voltage - Supply :
- 0.698V ~ 0.742V
- Mounting Style :
- SMD/SMT
- Number of LABs/CLBs :
- 5500
- Operating Temperature :
- -40°C ~ 100°C (TJ)
- Mounting Type :
- Surface Mount
- Package / Case :
- BGA-676
- Number of I/O :
- 228
- Series :
- XCAU10P
- Datasheets
- XCAU10P-1FFVB676I

FPGAs AMD Xilinx XCAU10P-1FFVB676I Overview
The AMD Xilinx XCAU10P-1FFVB676I represents a pinnacle in FPGA technology, offering a sophisticated blend of power, performance, and flexibility designed to meet the rigorous demands of modern digital applications. As part of the Artix UltraScale+ family, this FPGA is engineered for optimal efficiency and scalability, facilitating advanced system designs with reduced power consumption and enhanced functionality. This component integrates seamlessly into a variety of complex architectures, thanks to its robust configuration in a compact 676-ball BGA package. The utility and adaptability of the FPGAs AMD Xilinx XCAU10P-1FFVB676I make it an ideal choice for developers looking to push the boundaries of technological innovation.
XCAU10P-1FFVB676I Features
This advanced FPGA unit is equipped with high-speed transceivers, abundant logic cells, and a rich set of integrated DSP blocks. It supports numerous I/O standards and is designed for ease of use with Xilinx's Vivado Design Suite, enhancing both design productivity and performance optimization. Moreover, the device's high-integration capability facilitates reduced BOM cost and board space, making it highly suitable for compact, power-sensitive applications.
XCAU10P-1FFVB676I Applications
- Data Processing: Utilized in servers and data centers for high-speed data processing and throughput, enhancing computational efficiency and reliability.
- Telecommunications: Deployed in telecommunications infrastructure to handle complex signal processing tasks, supporting the demands of high-speed, high-volume communication networks.
- Automotive Systems: Ideal for integration in advanced driver-assistance systems (ADAS) and infotainment systems, providing robust processing capabilities that improve vehicle safety and user experience.
- Consumer Electronics: Incorporated in consumer electronics such as high-performance gaming consoles and smart home devices, where its ability to process multiple data streams in real-time is crucial.
- Medical Devices: Applied in medical imaging systems, such as ultrasound and MRI machines, to handle complex image processing tasks quickly and effectively.
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