XC7K70T-L2FBG676E
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- Mfr.Part #
- XC7K70T-L2FBG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 300 I/O 676FCBGA
- Stock
- 990
- In Stock ：
- 990
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RoHS Status :
- ROHS3 Compliant
- Terminal Form :
- Ball
- Number of I/O :
- 300
- Number of Terminations :
- 676
- Mount :
- Surface Mount
- Number of Registers :
- 82000
- Terminal Pitch :
- 1mm
- Height Seated (Max) :
- 2.54mm
- Total RAM Bits :
- 4976640
- Number of Pins :
- 676
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Operating Temperature :
- 0°C~100°C TJ
- Supply Voltage :
- 0.9V
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 0.97V~1.03V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Factory Lead Time :
- 10 Weeks
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 5125
- ECCN Code :
- 3A991.D
- RAM Size :
- 607.5kB
- Length :
- 27mm
- Pbfree Code :
- yes
- Number of Logic Elements/Cells :
- 65600
- Pin Count :
- 676
- Packaging :
- Tray
- Qualification Status :
- Not Qualified
- JESD-609 Code :
- e1
- Combinatorial Delay of a CLB-Max :
- 0.91 ns
- Series :
- Kintex®-7
- Number of Outputs :
- 300
- Operating Supply Voltage :
- 1V
- Base Part Number :
- XC7K70T
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Width :
- 27mm
- Published :
- 2010
- HTS Code :
- 8542.39.00.01
- Package / Case :
- 676-BBGA, FCBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Power Supplies :
- 0.91.83.3V
- Datasheets
- XC7K70T-L2FBG676E
FPGAs AMD Xilinx XC7K70T-L2FBG676E Overview
The AMD Xilinx XC7K70T-L2FBG676E FPGA stands out as a high-performance, adaptable solution engineered to meet the intensive demands of modern digital applications. This device from AMD Xilinx's Kintex-7 family combines exceptional processing power with high-level functionality, making it ideal for system designers looking to optimize both cost and performance. Its 676-pin FCBGA (ball grid array) packaging ensures robust physical connectivity, while the 300 I/O options provide ample flexibility for interfacing with other components in complex systems. Integrating this FPGA into your designs ensures scalability and adaptability, crucial for industries requiring rapid prototyping and high-speed data processing.
XC7K70T-L2FBG676E Features
This FPGA is designed to support a wide array of functionalities. Key features include a high logic gate density, comprehensive I/O connectivity, and advanced memory interfaces which are optimized for efficiency and speed. The XC7K70T-L2FBG676E also supports multiple clock management features and DSP slices, increasing the device's ability to handle complex, multifaceted operations and algorithms efficiently. Additionally, its compatibility with advanced serial connectivity standards, such as PCI Express and Gigabit Ethernet, further enhances its utility in high-performance environments.
XC7K70T-L2FBG676E Applications
- Data Centers: Utilized in server infrastructure to facilitate high-speed data processing and storage solutions, enhancing data throughput and system reliability.
- Telecommunications: Deployed in communication infrastructure equipment to enable robust signal processing capabilities, essential for 5G technology and network enhancements.
- Aerospace and Defense: Integral in avionics and military communication devices, offering reliable performance in extreme conditions and supporting advanced security protocols.
- Medical Imaging: Applied in diagnostic equipment such as MRI and CT scanners, where its processing power helps in rendering high-resolution images quickly and efficiently.
- Industrial Automation: Used in control systems to improve operational efficiency, provide real-time processing capabilities, and enhance machine-to-machine communication.
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