XC7K160T-1FF676C

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Mfr.Part #
XC7K160T-1FF676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FCBGA
Stock
26,230
In Stock :
26,230

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Registers :
202800
Terminal Position :
BOTTOM
Number of Terminations :
676
Operating Supply Voltage :
1V
Terminal Form :
Ball
Total RAM Bits :
11980800
Number of Outputs :
400
RoHS Status :
Non-RoHS Compliant
Number of I/O :
400
Published :
2010
Voltage - Supply :
0.97V~1.03V
Number of Logic Elements/Cells :
162240
Speed Grade :
1
RAM Size :
1.4MB
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-30 Code :
S-PBGA-B676
Propagation Delay :
120 ps
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Inputs :
400
Radiation Hardening :
No
Operating Temperature :
0°C~85°C TJ
Packaging :
Tray
Factory Lead Time :
11 Weeks
Series :
Kintex®-7
Base Part Number :
XC7K160
Package / Case :
676-BBGA, FCBGA
Number of LABs/CLBs :
12675
Mounting Type :
Surface Mount
Mount :
Surface Mount
Datasheets
XC7K160T-1FF676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K160T-1FF676C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Operating Temperature:0°C~85°C TJ, Base Part Number:XC7K160, Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, XC7K160T-1FF676C pinout, XC7K160T-1FF676C datasheet PDF, XC7K160T-1FF676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7K160T-1FF676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7K160T-1FF676C


FPGAs AMD Xilinx XC7K160T-1FF676C Overview

The AMD Xilinx XC7K160T-1FF676C FPGA is a high-performance, field-programmable gate array that stands out in the market due to its robust feature set designed to meet the needs of today's demanding digital applications. Ideal for designers looking to leverage speed and resource optimization in complex digital circuits, this device integrates seamlessly into various high-end and volume-driven market deployments. The 676-pin flip-chip ball grid array (FCBGA) packaging ensures a compact footprint while offering a dense I/O configuration, making it highly suitable for multi-functional integration in space-constrained environments. Its capability to support a variety of logic operations enables significant flexibility in hardware programming, which is critical for adaptive and scalable technology solutions.

XC7K160T-1FF676C Features

This FPGA from AMD Xilinx offers a comprehensive array of features including a vast array of 400 I/O pins that

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