XC7K70T-3FBG484E
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- Mfr.Part #
- XC7K70T-3FBG484E
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 285 I/O 484FCBGA
- Stock
- 990
- In Stock ：
- 990
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Length :
- 23mm
- Pbfree Code :
- yes
- Number of Terminations :
- 484
- RAM Size :
- 607.5kB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Packaging :
- Tray
- Base Part Number :
- XC7K70T
- RoHS Status :
- ROHS3 Compliant
- Terminal Form :
- Ball
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Published :
- 2010
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 23mm
- ECCN Code :
- 3A991.D
- Number of Pins :
- 484
- Number of Logic Elements/Cells :
- 65600
- Total RAM Bits :
- 4976640
- Power Supplies :
- 11.83.3V
- JESD-609 Code :
- e1
- Operating Temperature :
- 0°C~100°C TJ
- Contact Plating :
- Copper, Silver, Tin
- Number of Outputs :
- 285
- Number of Registers :
- 82000
- Qualification Status :
- Not Qualified
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Pin Count :
- 484
- Voltage - Supply :
- 0.97V~1.03V
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 10 Weeks
- Height Seated (Max) :
- 2.54mm
- HTS Code :
- 8542.39.00.01
- Combinatorial Delay of a CLB-Max :
- 0.58 ns
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 5125
- Series :
- Kintex®-7
- Reach Compliance Code :
- not_compliant
- Speed Grade :
- -3
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of I/O :
- 285
- Supply Voltage :
- 1V
- Package / Case :
- 484-BBGA, FCBGA
- Clock Frequency :
- 1412MHz
- Datasheets
- XC7K70T-3FBG484E
FPGAs AMD Xilinx XC7K70T-3FBG484E Overview
The FPGAs AMD Xilinx XC7K70T-3FBG484E is a highly versatile and powerful integrated circuit designed by AMD Xilinx, tailored for advanced digital processing applications. This FPGA model is built on a robust architecture that supports a wide array of functionalities, making it an ideal choice for developers looking to harness high-speed, reliable performance for complex projects. The device features 285 I/O pins housed in a compact 484-pin flip-chip BGA (FCBGA) package, enabling efficient space utilization and easier integration into various electronic assemblies. The XC7K70T-3FBG484E is engineered to meet the rigorous demands of high-throughput systems, offering a blend of flexibility, power, and precision crucial for both prototyping and mass production environments.
XC7K70T-3FBG484E Features
The XC7K70T-3FBG484E FPGA offers an impressive suite of features that cater to a demanding array of application needs. Key attributes include its high I/O pin count which facilitates extensive connectivity options, a fine-pitched 484 FCBGA package that minimizes board space while maximizing performance, and adaptable logic resources designed for optimal configuration. The chip supports multiple configuration schemes and possesses a robust clock management system, enhancing the performance stability and functional flexibility required in sophisticated electronic systems.
XC7K70T-3FBG484E Applications
- Consumer Electronics: Utilized in smart TVs and gaming consoles, the XC7K70T-3FBG484E enhances user interfaces and processing capabilities, ensuring smooth and responsive multimedia performance.
- Telecommunications: This FPGA is crucial in network routers and switches, enabling efficient data flow and signal processing to manage high-speed internet and telecommunication services.
- Automotive Systems: Applied in driver assistance systems, the XC7K70T-3FBG484E processes multiple sensor inputs simultaneously, ensuring rapid response times and reliability essential for safety-critical applications.
- Industrial Automation: In robotic systems, this FPGA manages precise control and real-time processing, optimizing operational efficiency and machine responsiveness in complex industrial environments.
- Medical Devices: Used in medical imaging equipment, the XC7K70T-3FBG484E supports detailed image processing and high data throughput, critical for accurate diagnostics and patient care.
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