XC7K70T-2FBG676I
- Mfr.Part #
- XC7K70T-2FBG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 300 I/O 676FCBGA
- Stock
- 970
- In Stock :
- 970
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Outputs :
- 300
- Series :
- Kintex®-7
- Contact Plating :
- Copper, Silver, Tin
- Height Seated (Max) :
- 2.54mm
- Number of Pins :
- 676
- Supply Voltage :
- 1V
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Factory Lead Time :
- 10 Weeks
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 0.97V~1.03V
- Number of Terminations :
- 676
- Speed Grade :
- -2
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -40°C~100°C TJ
- Power Supplies :
- 11.83.3V
- Length :
- 27mm
- RoHS Status :
- ROHS3 Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Clock Frequency :
- 1286MHz
- RAM Size :
- 607.5kB
- Pin Count :
- 676
- Number of Registers :
- 82000
- Base Part Number :
- XC7K70T
- Qualification Status :
- Not Qualified
- Number of I/O :
- 300
- Terminal Pitch :
- 1mm
- ECCN Code :
- 3A991.D
- Number of Logic Elements/Cells :
- 65600
- Number of LABs/CLBs :
- 5125
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- HTS Code :
- 8542.39.00.01
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- JESD-609 Code :
- e1
- Published :
- 2010
- Package / Case :
- 676-BBGA, FCBGA
- Width :
- 27mm
- Pbfree Code :
- yes
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Total RAM Bits :
- 4976640
- Surface Mount :
- yes
- Datasheets
- XC7K70T-2FBG676I
FPGAs + AMD Xilinx + XC7K70T-2FBG676I Overview
XC7K70T-2FBG676I 是 AMD Xilinx 出品的高级 FPGA (Field Programmable Gate Array) 产品,拥有 300 个可编程 I/O 和 676 个球栅阵列 (BGA) 封装。这款 FPGA 以其高性能、灵活性和可定制性而著称,非常适合在快速变化的技术环境中实现快速设计迭代和定制。该产品广泛应用于通信、数据中心、医疗设备、航空航天和工业自动化等领域,是各种复杂系统的核心组件。凭借其优异的可扩展性和丰富的接口选项,XC7K70T-2FBG676I 为客户提供了强大的工具来满足各种设计需求。
XC7K70T-2FBG676I Features
XC7K70T-2FBG676I 具有以下特点:
- 高达 300 个可编程 I/O:为各种外围设备提供灵活的接口选择。
- 676FCBGA 封装:紧凑且便于集成到不同的设备中。
- 高性能架构:可实现高速数据处理和复杂算法的执行。
- 支持多种开发工具:与 Xilinx 的开发套件兼容,方便开发和调试。
XC7K70T-2FBG676I Applications
- 通信系统:用于高速数据传输和信号处理。
- 数据中心:支持复杂的计算和数据管理任务。
- 医疗设备:在医疗成像和患者监护设备中提供实时数据处理能力。
- 航空航天:用于飞行控制系统和导航设备中的实时计算。
- 工业自动化:帮助自动化生产线和机器人系统实现高效运行。
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