XC7K70T-2FBG676C
- Mfr.Part #
- XC7K70T-2FBG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 300 I/O 676FCBGA
- Stock
- 990
- In Stock :
- 990
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RAM Size :
- 607.5kB
- Terminal Form :
- Ball
- Pbfree Code :
- yes
- HTS Code :
- 8542.39.00.01
- Speed Grade :
- -2
- Voltage - Supply :
- 0.97V~1.03V
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Power Supplies :
- 11.83.3V
- Number of Logic Elements/Cells :
- 65600
- Terminal Position :
- BOTTOM
- Package / Case :
- 676-BBGA, FCBGA
- Mounting Type :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Registers :
- 82000
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Base Part Number :
- XC7K70T
- Series :
- Kintex®-7
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 1mm
- Contact Plating :
- Copper, Silver, Tin
- Factory Lead Time :
- 10 Weeks
- Number of Pins :
- 676
- RoHS Status :
- ROHS3 Compliant
- Width :
- 27mm
- Pin Count :
- 676
- Total RAM Bits :
- 4976640
- Number of I/O :
- 300
- JESD-609 Code :
- e1
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage :
- 1V
- Number of LABs/CLBs :
- 5125
- ECCN Code :
- 3A991.D
- Number of Terminations :
- 676
- Clock Frequency :
- 1286MHz
- Number of Outputs :
- 300
- Height Seated (Max) :
- 2.54mm
- Published :
- 2010
- Operating Temperature :
- 0°C~85°C TJ
- Surface Mount :
- yes
- Length :
- 27mm
- Datasheets
- XC7K70T-2FBG676C
FPGAs AMD Xilinx XC7K70T-2FBG676C Overview
The FPGAs AMD Xilinx XC7K70T-2FBG676C represents a powerful component in the field of programmable logic devices. Designed by AMD Xilinx, a leader in digital design and fabrication, this FPGA boasts a robust architecture tailored for versatile applications. This particular model is packaged in a 676-pin FCBGA (Flip-Chip Ball Grid Array), allowing for superior performance in thermal management and space efficiency. With 300 configurable I/O options, it offers substantial flexibility for various design needs, making it an ideal choice for developers looking to harness the full potential of a programmable gate array.
XC7K70T-2FBG676C Features
The XC7K70T-2FBG676C FPGA is equipped with advanced features that meet the demands of modern electronics. It includes high-performance logic blocks for complex digital computations, a flexible I/O interface for improved compatibility with a wide range of peripheral devices, and robust power management capabilities. This FPGA also supports multiple design configurations, enabling developers to optimize their applications for speed, power efficiency, or cost, according to their specific requirements.
XC7K70T-2FBG676C Applications
- Data Centers: Utilized for managing data flows and network processing to enhance efficiency and speed in large-scale server environments.
- Telecommunication: Plays a critical role in signal processing and data transmission, ensuring reliable and fast communications across various platforms.
- Automotive: Integrated into driver assistance systems, providing processing power for sensor data analysis and real-time decision-making.
- Industrial Automation: Employed in control systems for factories, improving operational efficiency and precision in manufacturing processes.
- Consumer Electronics: Used in devices such as smartphones and tablets, contributing to power management and functionality enhancement.
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