XC7K420T-1FFG1156C
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- Mfr.Part #
- XC7K420T-1FFG1156C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 1156FCBGA
- Stock
- 8
- In Stock ：
- 8
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RoHS Status :
- ROHS3 Compliant
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Radiation Hardening :
- No
- Number of Logic Blocks (LABs) :
- 32575
- Speed Grade :
- -1
- Voltage - Supply :
- 0.97V~1.03V
- Supplier Device Package :
- 1156-FCBGA (35x35)
- Max Supply Voltage :
- 1.03V
- Base Part Number :
- XC7K420
- Package / Case :
- 1156-BBGA, FCBGA
- Number of Logic Elements/Cells :
- 416960
- Published :
- 2010
- Total RAM Bits :
- 30781440
- Max Operating Temperature :
- 85°C
- RAM Size :
- 3.7MB
- Min Supply Voltage :
- 970mV
- Factory Lead Time :
- 10 Weeks
- Min Operating Temperature :
- 0°C
- Number of LABs/CLBs :
- 32575
- Packaging :
- Tray
- Mounting Type :
- Surface Mount
- Series :
- Kintex®-7
- Operating Temperature :
- 0°C~85°C TJ
- Number of I/O :
- 400
- Number of Registers :
- 521200
- Datasheets
- XC7K420T-1FFG1156C
FPGAs AMD Xilinx XC7K420T-1FFG1156C Overview
The FPGAs AMD Xilinx XC7K420T-1FFG1156C represents a robust solution in the world of field-programmable gate arrays, designed to meet the evolving needs of modern digital systems. Engineered by AMD Xilinx, this FPGA is capable of supporting complex digital circuits with its 400 I/O pins and housed in a 1156-pin flip-chip ball grid array (FCBGA) package, offering optimal performance in a compact form. Ideal for applications requiring high-speed data processing and flexibility, the XC7K420T-1FFG1156C delivers unmatched performance and reliability, making it a go-to choice for developers and engineers looking to push the boundaries of technology.
XC7K420T-1FFG1156C Features
This FPGA stands out due to its large-scale integration capabilities and advanced technological features, which include a high pin count for extensive connectivity and integration options. The high-performance FPGA architecture ensures that applications run smoothly and efficiently, supporting a wide range of functionalities from simple logic gates to complex digital systems. The 1156FCBGA packaging not only protects the chip but also aids in efficient heat dissipation, critical for maintaining the reliability and longevity of the device under high-performance conditions.
XC7K420T-1FFG1156C Applications
- Data Centers: Utilized in server farms for accelerating data processing tasks, improving data throughput and energy efficiency within network infrastructure.
- Telecommunications: Applied in telecommunication infrastructure to enhance signal processing capabilities and support high-speed data transmission and bandwidth management.
- Aerospace and Defense: Key in avionics and military communications equipment, providing robust, secure programmable solutions capable of withstanding harsh environments and critical missions.
- Medical Imaging: Helps in the development of advanced medical imaging systems such as MRI and CT scanners, ensuring rapid processing of complex imaging data for quicker and more accurate diagnoses.
- Automotive: Integral to driver assistance systems and autonomous vehicle technologies, enabling sophisticated sensor integration and real-time decision making.
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