XC7K410T-3FFG676E
- Mfr.Part #
- XC7K410T-3FFG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 495
- In Stock :
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- RAM Size :
- 3.5MB
- Pbfree Code :
- yes
- JESD-30 Code :
- S-PBGA-B676
- Number of Inputs :
- 400
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Combinatorial Delay of a CLB-Max :
- 0.58 ns
- Pin Count :
- 676
- Packaging :
- Tray
- Series :
- Kintex®-7
- Number of Terminations :
- 676
- Speed Grade :
- -3
- Voltage - Supply :
- 0.97V~1.03V
- Power Supplies :
- 11.83.3V
- Operating Temperature :
- 0°C~100°C TJ
- Published :
- 2009
- Base Part Number :
- XC7K410T
- Number of LABs/CLBs :
- 31775
- Number of Outputs :
- 400
- Factory Lead Time :
- 12 Weeks
- Supply Voltage :
- 1V
- RoHS Status :
- ROHS3 Compliant
- ECCN Code :
- 3A991.D
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 1412MHz
- Length :
- 27mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Number of Logic Elements/Cells :
- 406720
- Width :
- 27mm
- Number of I/O :
- 400
- HTS Code :
- 8542.39.00.01
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max) :
- 3.37mm
- Number of Registers :
- 508400
- Package / Case :
- 676-BBGA, FCBGA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Total RAM Bits :
- 29306880
- Datasheets
- XC7K410T-3FFG676E
FPGAs AMD Xilinx XC7K410T-3FFG676E Overview
The FPGAs AMD Xilinx XC7K410T-3FFG676E is a high-performance, field-programmable gate array designed for applications that require a high degree of flexibility and performance. Manufactured by AMD Xilinx, this FPGA boasts an advanced feature set that makes it suitable for a wide range of industrial applications. Its 676-pin flip-chip ball grid array (FCBGA) packaging ensures robust physical integration in complex hardware environments. The XC7K410T-3FFG676E is particularly adept at handling multiple I/O operations with its 400 available I/O ports, making it a versatile choice for developers and engineers looking to push the boundaries of digital circuit design.
XC7K410T-3FFG676E Features
The XC7K410T-3FFG676E includes several features that stand out in the field of programmable logic devices. It offers a rich set of programmable logic for complex digital computations, high-speed DSP slices for efficient signal processing, and advanced memory technologies for improved data throughput. The device's high I/O count and flexible connectivity options enable extensive adaptability to both existing and new system architectures.
XC7K410T-3FFG676E Applications
- Data Centers: Utilized for managing data flow and processing operations within network infrastructure, enhancing throughput and efficiency.
- Telecommunications: Helps in handling complex signal processing tasks for base stations and network hubs, ensuring faster data transmission and reliable connectivity.
- Automotive: Suitable for driver assistance systems where its high-speed processing can manage multiple sensor inputs and actuate control commands in real time.
- Industrial Automation: Used in control systems that require high levels of customization and adaptability, enhancing operational efficiency and productivity.
- Consumer Electronics: Integral to the development of multimedia systems, gaming consoles, and high-performance portable devices, providing the necessary processing power and interface capabilities.
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