XC7K410T-3FBG900E
- Mfr.Part #
- XC7K410T-3FBG900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 900FCBGA
- Stock
- 8,298
- In Stock :
- 8,298
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Registers :
- 508400
- Reach Compliance Code :
- not_compliant
- Number of Terminations :
- 900
- Pin Count :
- 900
- Base Part Number :
- XC7K410T
- Factory Lead Time :
- 12 Weeks
- Terminal Form :
- Ball
- Published :
- 2009
- Package / Case :
- 900-BBGA, FCBGA
- Operating Temperature :
- 0°C~100°C TJ
- JESD-609 Code :
- e1
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 2.54mm
- Total RAM Bits :
- 29306880
- Combinatorial Delay of a CLB-Max :
- 0.58 ns
- Pbfree Code :
- yes
- Voltage - Supply :
- 0.97V~1.03V
- Terminal Position :
- BOTTOM
- Surface Mount :
- yes
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Series :
- Kintex®-7
- JESD-30 Code :
- S-PBGA-B900
- Width :
- 31mm
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Power Supplies :
- 11.83.3V
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Operating Supply Voltage :
- 1V
- Number of I/O :
- 500
- Number of LABs/CLBs :
- 31775
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- ECCN Code :
- 3A991.D
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 1V
- RAM Size :
- 3.5MB
- Length :
- 31mm
- Number of Logic Elements/Cells :
- 406720
- Speed Grade :
- -3
- Clock Frequency :
- 1412MHz
- Number of Outputs :
- 500
- Qualification Status :
- Not Qualified
- Number of Inputs :
- 500
- Datasheets
- XC7K410T-3FBG900E
FPGAs AMD Xilinx XC7K410T-3FBG900E Overview
The FPGAs AMD Xilinx XC7K410T-3FBG900E represents a cutting-edge solution in the realm of programmable logic devices. Engineered by AMD Xilinx, a leader in digital design technologies, this integrated circuit is optimized for high-performance applications requiring significant processing power and speed. Its deployment in a 900-pin flip-chip ball grid array (FCBGA) package allows for robust connectivity and superior performance in complex digital environments. This product is tailored for designers looking for versatile customization in hardware acceleration, signal processing, and system integration, making it a prime choice for high-end, scalable system designs.
XC7K410T-3FBG900E Features
This high-capacity FPGA from AMD Xilinx offers a wealth of features designed to enhance efficiency and performance in various applications. Key features include:
- 500 user-configurable I/O ports, providing extensive interfacing capabilities.
- Advanced high-speed DSP slices for efficient data processing.
- High integration capability suited for multi-functional devices.
- Robust thermal and power management features, ensuring reliable operation under demanding conditions.
- Support for numerous logic configurations, enabling highly customized solutions tailored to specific needs.
XC7K410T-3FBG900E Applications
- Data Centers: Utilized for managing data flows and accelerating network protocols, enhancing the efficiency and speed of data processing and storage systems.
- Telecommunications: Applied in telecom infrastructure to support complex signal processing tasks and real-time data handling, ensuring high reliability and service quality in communication networks.
- Automotive: Integrated into driver assistance systems to process real-time sensor data, contributing to safer and more intelligent vehicle functionalities.
- Medical Imaging: Used in advanced medical imaging devices, enabling rapid image processing capabilities essential for timely and accurate diagnostics.
- Industrial Automation: Employs robust control and processing capabilities in industrial machines and systems, optimizing operational efficiency and reliability.
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