XC7K410T-3FBG676E
- Mfr.Part #
- XC7K410T-3FBG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 15,323
- In Stock :
- 15,323
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 12 Weeks
- Operating Temperature :
- 0°C~100°C TJ
- Combinatorial Delay of a CLB-Max :
- 0.58 ns
- Pbfree Code :
- yes
- Number of Inputs :
- 400
- Width :
- 27mm
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Voltage - Supply :
- 0.97V~1.03V
- Qualification Status :
- Not Qualified
- Clock Frequency :
- 1412MHz
- Surface Mount :
- yes
- Number of Registers :
- 508400
- HTS Code :
- 8542.39.00.01
- Length :
- 27mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Form :
- Ball
- Speed Grade :
- -3
- Height Seated (Max) :
- 2.54mm
- Mounting Type :
- Surface Mount
- Power Supplies :
- 11.83.3V
- Terminal Pitch :
- 1mm
- Number of LABs/CLBs :
- 31775
- Number of Outputs :
- 400
- Base Part Number :
- XC7K410T
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 676
- Published :
- 2009
- Number of I/O :
- 400
- Total RAM Bits :
- 29306880
- JESD-30 Code :
- S-PBGA-B676
- RAM Size :
- 3.5MB
- Supply Voltage :
- 1V
- Packaging :
- Tray
- Series :
- Kintex®-7
- Package / Case :
- 676-BBGA, FCBGA
- Operating Supply Voltage :
- 1V
- ECCN Code :
- 3A991.D
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e1
- Number of Logic Elements/Cells :
- 406720
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RoHS Status :
- ROHS3 Compliant
- Pin Count :
- 676
- Datasheets
- XC7K410T-3FBG676E
FPGAs AMD Xilinx XC7K410T-3FBG676E Overview
The FPGAs AMD Xilinx XC7K410T-3FBG676E is a high-performance integrated circuit designed for versatile applications in the modern technological landscape. Manufactured by AMD Xilinx, a leader in digital design and integration, this FPGA (Field Programmable Gate Array) device is tailored to meet the demanding requirements of both high-speed computing and complex algorithm processing. Encased in a 676-pin FCBGA (Flip-Chip Ball Grid Array) package, it supports a vast array of I/O options with 400 accessible I/O pins, making it highly adaptable to varied design specifications. This product is ideal for developers seeking a robust platform for rapid prototyping and scalable designs that require a blend of power and efficiency.
XC7K410T-3FBG676E Features
The XC7K410T-3FBG676E FPGA offers a range of features that make it a top choice for complex electronic designs. Key features include its extensive I/O capabilities with 400 pins available for multifaceted connections and interfaces. The chip's high configurability and programmability allow for tailored functionality, supporting various logic integrations and customizations. Its compatibility with advanced digital signal processing enhances its utility in applications requiring high-speed data management and analysis.
XC7K410T-3FBG676E Applications
- Data Centers: Utilized in server farms for managing vast amounts of data processing, this FPGA increases the efficiency and speed of data transaction and storage systems.
- Telecommunications: In telecom infrastructure, the XC7K410T-3FBG676E supports high-speed communications and helps in the deployment of complex network topologies, enhancing signal integrity and data flow.
- Automotive Applications: Suitable for use in advanced driver-assistance systems (ADAS), where real-time processing and responsiveness are crucial for vehicle safety and navigation technologies.
- Medical Imaging: Plays a critical role in medical diagnostic equipment, such as MRI and CT scanners, facilitating rapid image processing and aiding in high-resolution imaging.
- Industrial Automation: Applied in automated manufacturing systems, this FPGA contributes to the refinement of control systems, sensor interfaces, and robotic operations, optimizing production lines for efficiency and reliability.
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