XC7K410T-2FBG900C
- Mfr.Part #
- XC7K410T-2FBG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 900FCBGA
- Stock
- 9,853
- In Stock :
- 9,853
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Pins :
- 900
- Pbfree Code :
- yes
- Voltage - Supply :
- 0.97V~1.03V
- Height Seated (Max) :
- 2.54mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- ECCN Code :
- 3A991.D
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of I/O :
- 500
- Total RAM Bits :
- 29306880
- Number of Terminations :
- 900
- Reach Compliance Code :
- not_compliant
- Packaging :
- Tray
- Number of Registers :
- 508400
- Speed Grade :
- -2
- Series :
- Kintex®-7
- Package / Case :
- 900-BBGA, FCBGA
- RAM Size :
- 3.5MB
- Terminal Pitch :
- 1mm
- RoHS Status :
- ROHS3 Compliant
- Clock Frequency :
- 1286MHz
- Number of LABs/CLBs :
- 31775
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- HTS Code :
- 8542.39.00.01
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Width :
- 31mm
- Number of Logic Elements/Cells :
- 406720
- Length :
- 31mm
- Number of Outputs :
- 500
- Published :
- 2009
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- JESD-609 Code :
- e1
- Operating Temperature :
- 0°C~85°C TJ
- Qualification Status :
- Not Qualified
- Pin Count :
- 900
- Supply Voltage :
- 1V
- Base Part Number :
- XC7K410T
- Factory Lead Time :
- 12 Weeks
- Contact Plating :
- Copper, Silver, Tin
- Mounting Type :
- Surface Mount
- Power Supplies :
- 11.83.3V
- Datasheets
- XC7K410T-2FBG900C
FPGAs AMD Xilinx XC7K410T-2FBG900C Overview
The AMD Xilinx XC7K410T-2FBG900C is a high-performance, field-programmable gate array (FPGA) that offers a robust platform for developing advanced digital computing systems. This FPGA is designed to meet the increasing demands of sophisticated electronic devices, featuring a dense arrangement of logic cells and a wide range of integrated features. With its 900-pin flip-chip ball grid array (FCBGA) packaging, the XC7K410T-2FBG900C provides excellent electrical conductivity and physical robustness, making it an ideal choice for developers looking to push the boundaries of technology in various applications. This product, integral to the FPGAs category, stands out for its adaptability and capacity to drive innovation in multiple sectors.
XC7K410T-2FBG900C Features
The XC7K410T-2FBG900C FPGA includes 500 I/O ports, enabling versatile connectivity and integration capabilities with other systems and modules. Its substantial logic resources facilitate complex digital processing tasks, essential for modern high-speed computing environments. The FPGA also supports a variety of design tools provided by AMD Xilinx, which simplifies development and speeds up time-to-market for new devices and systems.
XC7K410T-2FBG900C Applications
- Data Centers: Utilized for managing high-speed data processing and storage solutions, enhancing data throughput and operational efficiency in server farms.
- Telecommunications: Employs its high I/O count and processing power to handle the demands of network infrastructure, improving bandwidth and reducing latency in communications systems.
- Automotive: Integrated into driver assistance systems, contributing to safer driving through faster processing of sensor data and implementation of real-time decision-making systems.
- Industrial Automation: Critical in the control systems for monitoring and managing automated production lines, increasing precision and productivity in manufacturing processes.
- Medical Devices: Applied in medical imaging systems, allowing for rapid and accurate processing of complex imaging data to support diagnostics and treatment planning.
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