XC7K410T-2FBG676C
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- Mfr.Part #
- XC7K410T-2FBG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 502
- In Stock ：
- 502
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- 3A991.D
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Number of Outputs :
- 400
- Base Part Number :
- XC7K410T
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 12 Weeks
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Surface Mount :
- yes
- Packaging :
- Tray
- Series :
- Kintex®-7
- Length :
- 27mm
- Height Seated (Max) :
- 2.54mm
- Voltage - Supply :
- 0.97V~1.03V
- Pbfree Code :
- yes
- Terminal Form :
- Ball
- Number of I/O :
- 400
- Total RAM Bits :
- 29306880
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Logic Elements/Cells :
- 406720
- Operating Temperature :
- 0°C~85°C TJ
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Width :
- 27mm
- Number of LABs/CLBs :
- 31775
- JESD-609 Code :
- e1
- Number of Registers :
- 508400
- Power Supplies :
- 11.83.3V
- Supply Voltage :
- 1V
- HTS Code :
- 8542.39.00.01
- Number of Terminations :
- 676
- Package / Case :
- 676-BBGA, FCBGA
- Speed Grade :
- -2
- Clock Frequency :
- 1286MHz
- Contact Plating :
- Copper, Silver, Tin
- Published :
- 2009
- RAM Size :
- 3.5MB
- Pin Count :
- 676
- Terminal Pitch :
- 1mm
- Number of Pins :
- 676
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XC7K410T-2FBG676C
FPGAs AMD Xilinx XC7K410T-2FBG676C Overview
The FPGAs AMD Xilinx XC7K410T-2FBG676C represents a high-performance, field-programmable gate array designed for advanced systems requiring high-speed data processing and versatile I/O capabilities. Manufactured by AMD Xilinx, this IC FPGA integrates robust features into a compact 676-pin flip-chip ball grid array (FCBGA) package, making it ideal for scalable architectures in demanding applications. This device offers a flexible solution for developers looking to harness the power of programmable logic alongside a high count of I/O options, ensuring adaptability and performance in complex electronic environments.
XC7K410T-2FBG676C Features
This FPGA features a high logic gate count, enabling sophisticated digital computations and signal processing. Its 400 I/O pins provide ample connectivity for various peripherals and interfaces, suitable for high-bandwidth applications. The 676FCBGA packaging not only allows for a compact footprint but also enhances thermal management and reliability in industrial applications. Additionally, its compatibility with the Vivado Design Suite streamlines development, from design inception through debugging and deployment.
XC7K410T-2FBG676C Applications
- Telecommunications Equipment: Utilized in routers and switches, this FPGA manages high-speed data transmissions, enhancing network efficiency and reliability.
- Data Center Infrastructure: Supports server farm and storage system operations by accelerating data processing tasks and handling complex workload management.
- Automotive Systems: Employs in advanced driver-assistance systems (ADAS) to process real-time sensor data, improving vehicle safety and performance.
- Medical Imaging: Critical in devices such as MRI and ultrasound equipment, facilitating fast and accurate image processing for better diagnostic capabilities.
- Aerospace and Defense: Integral to avionics systems, where it processes navigational data and supports communication and radar systems.
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