XC7K355T-2FFG901I
- Mfr.Part #
- XC7K355T-2FFG901I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 300 I/O 901FCBGA
- Stock
- 1,839
- In Stock :
- 1,839
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-609 Code :
- e1
- Mounting Type :
- Surface Mount
- HTS Code :
- 8542.39.00.01
- Reach Compliance Code :
- not_compliant
- Speed Grade :
- -2
- RoHS Status :
- ROHS3 Compliant
- Number of I/O :
- 300
- Package / Case :
- 900-BBGA, FCBGA
- Series :
- Kintex®-7
- Number of Logic Elements/Cells :
- 356160
- Total RAM Bits :
- 26357760
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 0.97V~1.03V
- Base Part Number :
- XC7K355T
- Pin Count :
- 901
- Packaging :
- Tray
- Height Seated (Max) :
- 3.35mm
- Length :
- 31mm
- Power Supplies :
- 11.83.3V
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 27825
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Supply Voltage :
- 1V
- RAM Size :
- 3.1MB
- Clock Frequency :
- 1286MHz
- Pbfree Code :
- yes
- Number of Inputs :
- 300
- JESD-30 Code :
- S-PBGA-B901
- Qualification Status :
- Not Qualified
- Width :
- 31mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of Terminations :
- 901
- Number of Registers :
- 445200
- ECCN Code :
- 3A991.D
- Operating Temperature :
- -40°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Outputs :
- 300
- Published :
- 2010
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Form :
- Ball
- Surface Mount :
- yes
- Factory Lead Time :
- 10 Weeks
- Datasheets
- XC7K355T-2FFG901I
FPGAs AMD Xilinx XC7K355T-2FFG901I Overview
The FPGAs AMD Xilinx XC7K355T-2FFG901I is a highly capable FPGA from AMD Xilinx, designed to meet the complex and demanding requirements of modern electronic systems. This integrated circuit features a robust configuration with 300 I/O options, housed in a 901-pin flip-chip ball grid array (FCBGA) package. This product leverages the advanced technology of Xilinx to provide high-performance, flexibility, and efficiency essential for today's scalable and multi-functional devices. Its adaptability makes it ideal for a broad range of applications, particularly in scenarios requiring rapid processing and substantial data handling capabilities.
XC7K355T-2FFG901I Features
This particular model of FPGA offers several key features that enhance its utility in complex electronic environments. The 300 I/Os provide extensive connectivity options, facilitating integration into multi-component systems. The 901FCBGA packaging ensures robust physical protection and reliable connection to motherboards and other hardware interfaces. With its advanced FPGA technology, it supports numerous logic operations and is configurable post-production, allowing for maximum design flexibility and upgradability post-deployment.
XC7K355T-2FFG901I Applications
- Telecommunications Equipment: Utilized in routers and switches for managing signal processing tasks efficiently, ensuring high-speed data transmission and robust network performance.
- Automotive Systems: Integrated into driver assistance systems (DAS), managing sensor inputs and vehicle data to support features like adaptive cruise control and collision avoidance.
- Data Centers: Plays a critical role in data processing and storage solutions, enhancing data retrieval and energy efficiency in server operations.
- Consumer Electronics: Employed in high-performance gaming consoles and home entertainment systems to manage complex graphics and user interface operations.
- Industrial Automation: Used in control systems for manufacturing processes, providing the computational power needed to monitor and control assembly lines with precision and reliability.
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