XC7K355T-1FF901I
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- Mfr.Part #
- XC7K355T-1FF901I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 300 I/O 901FCBGA
- Stock
- 15,970
- In Stock ：
- 15,970
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Operating Supply Voltage :
- 1V
- Number of Outputs :
- 300
- Number of Inputs :
- 300
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- JESD-30 Code :
- S-PBGA-B900
- Propagation Delay :
- 120 ps
- Package / Case :
- 900-BBGA, FCBGA
- Factory Lead Time :
- 11 Weeks
- Radiation Hardening :
- No
- Number of Registers :
- 445200
- Packaging :
- Tray
- Operating Temperature :
- -40°C~100°C TJ
- Speed Grade :
- 1
- RoHS Status :
- Non-RoHS Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Terminal Form :
- Ball
- Number of Logic Elements/Cells :
- 356160
- Base Part Number :
- XC7K355T
- RAM Size :
- 3.1MB
- Total RAM Bits :
- 26357760
- Number of Terminations :
- 900
- Number of LABs/CLBs :
- 27825
- Voltage - Supply :
- 0.97V~1.03V
- Published :
- 2010
- Number of I/O :
- 300
- Series :
- Kintex®-7
- Datasheets
- XC7K355T-1FF901I
FPGAs AMD Xilinx XC7K355T-1FF901I Overview
The AMD Xilinx XC7K355T-1FF901I FPGA offers a highly versatile, high-performance programmable solution designed to meet the complex needs of modern digital systems. Equipped with advanced features and a robust I/O capability housed in a 901-pin FCBGA package, this FPGA is an ideal choice for developers and engineers looking to push the boundaries of technology in their projects. The integration of state-of-the-art technology by AMD Xilinx in this model allows for superior configurability and scalability, making it a top choice for applications requiring high-speed data processing and complex logic operations.
XC7K355T-1FF901I Features
This FPGA model boasts 300 I/O ports, which provide ample connectivity options for various peripheral devices, enhancing system design flexibility and performance. The compact 901-pin flip-chip ball grid array (FCBGA) package ensures a minimized footprint while allowing for efficient heat dissipation and reliability in high-density applications. This model's enhanced configuration options facilitate rapid development and deployment of custom hardware acceleration features, thus optimizing overall system efficiency.
XC7K355T-1FF901I Applications
- Data Centers: Utilized in server farms for accelerating data processing tasks, improving the efficiency of data throughput and reducing latency.
- Telecommunications: Employed in network infrastructure to enhance signal processing capabilities and support advanced communication protocols.
- Aerospace and Defense: Integral in navigation and communication systems, providing robust, reliable processing power required in critical missions.
- Medical Imaging: Used in advanced diagnostic equipment, helping to process complex imaging data quickly and with high precision.
- Automotive: Applied in driver assistance systems to process real-time data from vehicle sensors, aiding in decision-making and enhancing safety features.
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