XC7K325T-L2FFG900E
- Mfr.Part #
- XC7K325T-L2FFG900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 900FCBGA
- Stock
- 49,936
- In Stock :
- 49,936
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- JESD-609 Code :
- e1
- Combinatorial Delay of a CLB-Max :
- 0.91 ns
- Supply Voltage :
- 0.9V
- Published :
- 2009
- Height Seated (Max) :
- 3.35mm
- Pbfree Code :
- yes
- ECCN Code :
- 3A991.D
- Number of Terminations :
- 900
- Number of Logic Elements/Cells :
- 326080
- Number of Registers :
- 407600
- Packaging :
- Tray
- Length :
- 31mm
- Terminal Position :
- BOTTOM
- Width :
- 31mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of I/O :
- 500
- Terminal Form :
- Ball
- Number of Outputs :
- 500
- Factory Lead Time :
- 11 Weeks
- Reach Compliance Code :
- not_compliant
- Power Supplies :
- 0.91.83.3V
- Terminal Pitch :
- 1mm
- JESD-30 Code :
- S-PBGA-B900
- Base Part Number :
- XC7K325T
- Operating Temperature :
- 0°C~100°C TJ
- Pin Count :
- 900
- Memory Type :
- DDR3
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RoHS Status :
- ROHS3 Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Memory Size :
- 1GB
- RAM Size :
- 2MB
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Series :
- Kintex®-7
- Number of LABs/CLBs :
- 25475
- Qualification Status :
- Not Qualified
- Mount :
- Surface Mount
- Additional Feature :
- ALSO OPERATES AT 1 V SUPPLY
- Number of Inputs :
- 500
- HTS Code :
- 8542.39.00.01
- Voltage - Supply :
- 0.87V~0.93V
- Package / Case :
- 900-BBGA, FCBGA
- Total RAM Bits :
- 16404480
- Datasheets
- XC7K325T-L2FFG900E

FPGAs AMD Xilinx XC7K325T-L2FFG900E Overview
The FPGAs AMD Xilinx XC7K325T-L2FFG900E represents a pivotal advancement in the field of integrated circuits, engineered to meet the demanding needs of high-performance computing environments. This product, designed by AMD Xilinx, features a robust 900FCBGA package that efficiently handles a multitude of I/O options, making it exceptionally versatile for a wide range of applications. The XC7K325T-L2FFG900E is specifically tailored to deliver exceptional processing power and flexibility, ensuring that it stands out as a top choice for developers looking to push the boundaries of what's possible with electronic design.
XC7K325T-L2FFG900E Features
The XC7K325T-L2FFG900E FPGA boasts a comprehensive suite of features that enhance its utility in complex electronic assemblies. Key attributes include its expansive 500 I/O capacity, which facilitates extensive connectivity and integration possibilities. The compact 900FCBGA package is engineered for optimized thermal management and reduced footprint on PCBs. Additionally, the device supports advanced digital signal processing, making it ideal for applications requiring intensive computational operations and high-speed data handling.
XC7K325T-L2FFG900E Applications
- Telecommunications Equipment: Utilized in routers and switches, the XC7K325T-L2FFG900E manages high-speed data transmission and signal processing to maintain robust communication networks.
- Data Centers: Supports infrastructure by accelerating data processing capabilities and improving energy efficiency, crucial for managing large-scale data operations.
- Automotive Technology: Integral in advanced driver-assistance systems (ADAS), the FPGA processes multiple inputs from sensors and cameras to enhance vehicle safety and performance.
- Medical Devices: Used in medical imaging systems, such as MRI and ultrasound machines, to process complex imaging data rapidly and with high precision.
- Aerospace and Defense: Employs in avionics for navigation and communication systems, ensuring reliable operation under critical conditions.
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