XC7K325T-L2FFG676I
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- Mfr.Part #
- XC7K325T-L2FFG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 1,990
- In Stock ：
- 1,990
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Published :
- 2010
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- ECCN Code :
- 3A991.D
- Total RAM Bits :
- 16404480
- Contact Plating :
- Copper, Silver, Tin
- Operating Supply Voltage :
- 950mV
- Height Seated (Max) :
- 3.37mm
- Width :
- 27mm
- Factory Lead Time :
- 11 Weeks
- Number of I/O :
- 400
- Voltage - Supply :
- 0.97V~1.03V
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Number of Terminations :
- 676
- Package / Case :
- 676-BBGA, FCBGA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- HTS Code :
- 8542.39.00.01
- Number of Registers :
- 407600
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- ROHS3 Compliant
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Length :
- 27mm
- Reach Compliance Code :
- not_compliant
- Number of LABs/CLBs :
- 25475
- Series :
- Kintex®-7
- Terminal Form :
- Ball
- JESD-609 Code :
- e1
- RAM Size :
- 2MB
- Terminal Pitch :
- 1mm
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- JESD-30 Code :
- S-PBGA-B676
- Propagation Delay :
- 100 ps
- Memory Type :
- DDR3
- Packaging :
- Tray
- Operating Temperature :
- -40°C~100°C TJ
- Memory Size :
- 1GB
- Supply Voltage :
- 0.95V
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of Logic Elements/Cells :
- 326080
- Datasheets
- XC7K325T-L2FFG676I
FPGAs AMD Xilinx XC7K325T-L2FFG676I Overview
Introducing the cutting-edge FPGAs AMD Xilinx XC7K325T-L2FFG676I, a highly sophisticated field programmable gate array (FPGA) designed to meet the demanding requirements of modern embedded systems. This device, housed in a 676-pin flip-chip ball grid array (FCBGA) package, supports a wide array of applications, thanks to its versatile 400 I/O ports. Manufactured by AMD Xilinx, a leader in digital design and fabrication, this FPGA ensures robust performance for high-throughput applications. The XC7K325T-L2FFG676I is an ideal choice for developers looking to leverage speed and integration in sophisticated digital computing environments.
XC7K325T-L2FFG676I Features
The XC7K325T-L2FFG676I FPGA from AMD Xilinx offers several key features that distinguish it in the market:
- High I/O Pin Count: 400 I/O pins enable extensive interfacing with other peripherals and systems.
- Advanced 28nm Technology: Ensures reduced power consumption and enhanced performance.
- Integrated DSP Slices: Facilitates efficient processing for high-speed signal and image processing tasks.
- Robust Security Features: Includes advanced cryptographic features for secure data management.
- Flexible Logic Resources: Allows for custom configuration to meet specific project needs.
XC7K325T-L2FFG676I Applications
- Telecommunications Equipment
The high I/O capacity and advanced signal processing capabilities make the XC7K325T-L2FFG676I ideal for telecommunications infrastructure, including routers and switches.
- Automotive Driver Assistance Systems
Its ability to process complex algorithms rapidly allows it to be integrated into safety-critical automotive applications, such as advanced driver-assistance systems (ADAS).
- Medical Imaging Devices
The integrated DSP slices support sophisticated image processing tasks necessary for medical imaging technologies like MRI and ultrasound machines.
- Industrial Automation
This FPGA can be applied to control systems in automated production lines, enhancing both precision and reliability in industrial settings.
- Aerospace and Defense Systems
Given its robust security features and high performance, the XC7K325T-L2FFG676I is well-suited for applications in aerospace and defense electronics that require secure and reliable data processing.
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