XC7K325T-L2FFG676E
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- Mfr.Part #
- XC7K325T-L2FFG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 33,582
- In Stock ：
- 33,582
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Additional Feature :
- ALSO OPERATES AT 1 V SUPPLY
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Qualification Status :
- Not Qualified
- Published :
- 2010
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Supply Voltage :
- 0.9V
- ECCN Code :
- 3A991.D
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~100°C TJ
- Mounting Type :
- Surface Mount
- Number of Inputs :
- 400
- Number of Logic Elements/Cells :
- 326080
- Pbfree Code :
- yes
- Number of Registers :
- 407600
- Power Supplies :
- 0.91.83.3V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Total RAM Bits :
- 16404480
- Width :
- 27mm
- Series :
- Kintex®-7
- Combinatorial Delay of a CLB-Max :
- 0.91 ns
- Memory Size :
- 1GB
- Reach Compliance Code :
- not_compliant
- JESD-30 Code :
- S-PBGA-B676
- Base Part Number :
- XC7K325T
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- JESD-609 Code :
- e1
- Number of LABs/CLBs :
- 25475
- Terminal Form :
- Ball
- HTS Code :
- 8542.39.00.01
- Mount :
- Surface Mount
- Number of I/O :
- 400
- RAM Size :
- 2MB
- Length :
- 27mm
- Factory Lead Time :
- 11 Weeks
- Voltage - Supply :
- 0.87V~0.93V
- RoHS Status :
- ROHS3 Compliant
- Height Seated (Max) :
- 3.37mm
- Packaging :
- Tray
- Number of Terminations :
- 676
- Package / Case :
- 676-BBGA, FCBGA
- Number of Outputs :
- 400
- Pin Count :
- 676
- Memory Type :
- DDR3
- Datasheets
- XC7K325T-L2FFG676E
FPGAs AMD Xilinx XC7K325T-L2FFG676E Overview
The AMD Xilinx XC7K325T-L2FFG676E is a high-performance Field Programmable Gate Array (FPGA) designed for advanced systems requiring high throughput, versatile interfacing, and adaptive processing capabilities. This FPGA integrates robust I/O capabilities within a compact 676-pin flip-chip Ball Grid Array (FCBGA) package, making it an ideal choice for developers aiming to build scalable and efficient hardware in telecommunications, data processing, and industrial applications. Its flexibility and programmability make the FPGAs AMD Xilinx XC7K325T-L2FFG676E a cornerstone in applications where reconfiguration and adaptability are required.
XC7K325T-L2FFG676E Features
This model boasts an impressive array of features, including a 400 I/O pin configuration which allows for extensive connectivity options. These I/O capabilities, combined with its high-speed data processing architecture, facilitate complex and demanding applications. The FPGA is built for robust performance and reliability in a variety of environments, further backed by AMD Xilinx's leading-edge technology in programmable logic solutions.
XC7K325T-L2FFG676E Applications
- Telecommunications Equipment: Utilizes its high I/O count and processing power to manage multiple data streams and communications protocols effectively.
- Data Centers: Serves as a core component in data processing units, handling extensive computations and data routing with ease.
- Industrial Automation: Employs its adaptability in programmable logic to control machinery and processes, improving efficiency and safety in industrial settings.
- Medical Devices: Used in advanced medical imaging and diagnostic equipment, offering the necessary speed and precision for critical healthcare applications.
- Aerospace and Defense: Critical in navigation and control systems, providing the reliability and robust performance required in harsh environments and demanding applications.
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