XC7K325T-L2FBG900E
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- Mfr.Part #
- XC7K325T-L2FBG900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 900FCBGA
- Stock
- 1,782
- In Stock ：
- 1,782
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mount :
- Surface Mount
- Number of Logic Elements/Cells :
- 326080
- HTS Code :
- 8542.39.00.01
- Factory Lead Time :
- 11 Weeks
- Base Part Number :
- XC7K325T
- Length :
- 31mm
- Terminal Pitch :
- 1mm
- Published :
- 2010
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Package / Case :
- 900-BBGA, FCBGA
- JESD-609 Code :
- e1
- Qualification Status :
- Not Qualified
- Additional Feature :
- ALSO OPERATES AT 1 V SUPPLY
- Width :
- 31mm
- Mounting Type :
- Surface Mount
- ECCN Code :
- 3A991.D
- Supply Voltage :
- 0.9V
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Packaging :
- Tray
- Number of LABs/CLBs :
- 25475
- Total RAM Bits :
- 16404480
- Number of Terminations :
- 900
- RoHS Status :
- ROHS3 Compliant
- Pbfree Code :
- yes
- Terminal Form :
- Ball
- Memory Type :
- DDR3
- Number of Pins :
- 900
- Power Supplies :
- 0.91.83.3V
- Voltage - Supply :
- 0.97V~1.03V
- Pin Count :
- 900
- Number of Outputs :
- 500
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of I/O :
- 500
- Memory Size :
- 1GB
- Operating Temperature :
- 0°C~100°C TJ
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Combinatorial Delay of a CLB-Max :
- 0.91 ns
- Reach Compliance Code :
- not_compliant
- Height Seated (Max) :
- 2.54mm
- Series :
- Kintex®-7
- Number of Registers :
- 407600
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RAM Size :
- 2MB
- Contact Plating :
- Copper, Silver, Tin
- Datasheets
- XC7K325T-L2FBG900E
FPGAs AMD Xilinx XC7K325T-L2FBG900E Overview
The AMD Xilinx XC7K325T-L2FBG900E is a high-performance Field Programmable Gate Array (FPGA) designed to meet the rigorous demands of modern digital signal processing and high-speed communication applications. This IC FPGA integrates advanced features into its 900FCBGA packaging, accommodating 500 I/Os for versatile connectivity options. Tailored for developers aiming to leverage rapid prototyping and scalable solutions, the XC7K325T-L2FBG900E provides a robust platform for innovation and development across a range of industries.
XC7K325T-L2FBG900E Features
The XC7K325T-L2FBG900E FPGA from AMD Xilinx offers a substantial array of capabilities suitable for complex digital computations and data management. Key features include its expansive I/O interface, supporting up to 500 connections that facilitate extensive peripheral and modular design flexibility. Furthermore, its compact 900FCBGA packaging ensures a minimal footprint on system boards, which is crucial for dense circuit designs. This device is built for efficiency and high-speed performance, ensuring that applications not only meet but exceed the current market expectations.
XC7K325T-L2FBG900E Applications
- Telecommunications: Employed in base station development, the XC7K325T-L2FBG900E enhances signal processing capabilities and supports faster data transmission and reception, improving network reliability and throughput.
- Data Centers: Integral to server infrastructure, this FPGA accelerates data processing tasks, optimizes server load balancing, and enhances cloud computing operations.
- Aerospace and Defense: Used in radar and satellite systems, the XC7K325T-L2FBG900E offers the robust processing power required for real-time signal processing and control applications in harsh environments.
- Medical Imaging: In medical imaging technologies such as MRI and CT scanners, this FPGA facilitates the rapid processing of complex imaging algorithms, improving both the speed and accuracy of diagnostic procedures.
- Industrial Automation: Enhancing control systems and robotic applications, the XC7K325T-L2FBG900E drives the development of smarter, more efficient industrial automation solutions.
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