XC7K325T-L2FBG676E
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- Mfr.Part #
- XC7K325T-L2FBG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 47,804
- In Stock ：
- 47,804
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Pitch :
- 1mm
- HTS Code :
- 8542.39.00.01
- Operating Temperature :
- 0°C~100°C TJ
- RoHS Status :
- ROHS3 Compliant
- Power Supplies :
- 0.91.83.3V
- Series :
- Kintex®-7
- Total RAM Bits :
- 16404480
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Supply Voltage :
- 0.9V
- Voltage - Supply :
- 0.97V~1.03V
- Length :
- 27mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Height Seated (Max) :
- 2.54mm
- Number of Pins :
- 676
- Number of LABs/CLBs :
- 25475
- Combinatorial Delay of a CLB-Max :
- 0.91 ns
- Qualification Status :
- Not Qualified
- Published :
- 2010
- Width :
- 27mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Pbfree Code :
- yes
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Logic Elements/Cells :
- 326080
- Mounting Type :
- Surface Mount
- Number of I/O :
- 400
- Number of Terminations :
- 676
- Packaging :
- Tray
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- JESD-609 Code :
- e1
- Operating Supply Voltage :
- 1V
- Factory Lead Time :
- 11 Weeks
- Package / Case :
- 676-BBGA, FCBGA
- ECCN Code :
- 3A991.D
- RAM Size :
- 2MB
- Base Part Number :
- XC7K325T
- Number of Outputs :
- 400
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Number of Registers :
- 407600
- Mount :
- Surface Mount
- Pin Count :
- 676
- Datasheets
- XC7K325T-L2FBG676E
FPGAs AMD Xilinx XC7K325T-L2FBG676E Overview
The AMD Xilinx XC7K325T-L2FBG676E is a high-performance FPGA from the Kintex-7 family, designed to meet the demanding requirements of high-speed connectivity and processing. This FPGA features a high-density, low-power 28 nm technology, making it ideal for advanced embedded systems that require high-speed DSP capabilities and agile data processing. With its 400 I/O options housed in a compact 676-pin flip-chip BGA package, the XC7K325T-L2FBG676E enables robust interfacing and miniaturization of hardware designs. This makes it a perfect choice for developers looking to harness the power of FPGAs to drive innovation in their products, particularly in industries that require high reliability and precision.
XC7K325T-L2FBG676E Features
This particular model offers a versatile feature set, including high-performance logic cells, extensive DSP slices, and ample memory for complex digital processing tasks. Key features include support for high-speed transceivers, advanced power management, and multiple logic configuration options. Such capabilities make it suitable for a broad range of applications, from video processing to complex digital communication systems.
XC7K325T-L2FBG676E Applications
- Data Centers: Utilized in server architecture for efficient data processing and high-speed communications within the network infrastructure.
- Medical Imaging: Employs its high DSP slice count for fast and precise imaging processes, crucial for medical diagnostic equipment like MRI and CT scanners.
- Aerospace: Integral in avionics for processing and controlling flight data in real-time, enhancing both performance and safety metrics.
- Telecommunications: Supports high-speed signal processing tasks required in modern telecommunication infrastructures, including base stations and network switches.
- Automotive: Used in driver assistance systems (ADAS) to process multiple real-time inputs from vehicle sensors, improving safety and vehicle dynamics.
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